Inventor

WUU JOHN

US27 patents

⚠️ This page may combine multiple inventors who share the name “WUU JOHN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WUU JOHN

ADVANCED MICRO DEVICES INC

Flexibile interfaces using through-silicon via technology

Voltage-aware signal path synchronization

Configuration of multi-die modules with through-silicon vias

Memory with expandable row width

Memory with expandable row width

Memory array test logic

Stacked die circuit routing system and method

Low power cache

Swizzling in 3D stacked memory

Arrangement and thermal management of 3D stacked dies

Arrangement and thermal management of 3D stacked dies

Arrangement and thermal management of 3D stacked dies

Memory device and method of refreshing

Memory with expandable row width

Devices and systems for flying bitline with jumper cell

Through-silicon via layout for multi-die integrated circuits

Apparatus, system, and method for reducing the footprints of circuits that protect against the antenna effect and electrostatic discharge

Timer for use dual voltage supplies

HEWLETT PACKARD CO

Distributed decode system and method for improving static random access memory (SRAM) density

Integrated weak write test mode (WWWTM)

Multi-port static random access memory design for column interleaved arrays

HEWLETT PACKARD DEVELOPMENT CO

System and method for avoiding attempts to access a defective portion of memory

Programmable weak write test mode (PWWTM) bias generation having logic high output default mode

Bitline splitter

(unassigned)

Static random access memory (SRAM) array central global decoder system and method

WUU JOHN

Arrangement and thermal management of 3D stacked dies

DHONG SANG

Memory device and method thereof