P

Inventor

CHIANG TONY

US111 patents
⚠️ This page may combine multiple inventors who share the name “CHIANG TONY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

APPLIED MATERIALS INC

21 patents
US6919275B2Jul 19, 2005

Method of preventing diffusion of copper through a tantalum-comprising barrier layer

APPLIED MATERIALS INC87 citations99
US6328871B1Dec 11, 2001

Barrier layer for electroplating processes

APPLIED MATERIALS INC161 citations99
US6287977B1Sep 11, 2001

Method and apparatus for forming improved metal interconnects

APPLIED MATERIALS INC161 citations99
US6066892AMay 23, 2000

Copper alloy seed layer for copper metallization in an integrated circuit

APPLIED MATERIALS INC185 citations99
US6037257AMar 14, 2000

Sputter deposition and annealing of copper alloy metallization

APPLIED MATERIALS INC117 citations99
US7253109B2Aug 7, 2007

Method of depositing a tantalum nitride/tantalum diffusion barrier layer system

APPLIED MATERIALS INC44 citations96
US7074714B2Jul 11, 2006

Method of depositing a metal seed layer on semiconductor substrates

APPLIED MATERIALS INC26 citations96
US6992012B2Jan 31, 2006

Method and apparatus for forming improved metal interconnects

APPLIED MATERIALS INC35 citations96
US6758947B2Jul 6, 2004

Damage-free sculptured coating deposition

APPLIED MATERIALS INC47 citations96
US6709987B2Mar 23, 2004

Method and apparatus for forming improved metal interconnects

APPLIED MATERIALS INC55 citations96
US6627050B2Sep 30, 2003

Method and apparatus for depositing a tantalum-containing layer on a substrate

APPLIED MATERIALS INC67 citations96
US6605197B1Aug 12, 2003

Method of sputtering copper to fill trenches and vias

APPLIED MATERIALS INC57 citations96
US6559061B2May 6, 2003

Method and apparatus for forming improved metal interconnects

APPLIED MATERIALS INC63 citations96
US6387805B2May 14, 2002

Copper alloy seed layer for copper metallization

APPLIED MATERIALS INC58 citations96
US6160315ADec 12, 2000

Copper alloy via structure

APPLIED MATERIALS INC73 citations96
US6139699AOct 31, 2000

Sputtering methods for depositing stress tunable tantalum and tantalum nitride films

APPLIED MATERIALS INC72 citations96
US7381639B2Jun 3, 2008

Method of depositing a metal seed layer on semiconductor substrates

APPLIED MATERIALS INC10 citations93
US6458255B2Oct 1, 2002

Ultra-low resistivity tantalum films and methods for their deposition

APPLIED MATERIALS INC32 citations93
US6790776B2Sep 14, 2004

Barrier layer for electroplating processes

APPLIED MATERIALS INC34 citations92
US6488823B1Dec 3, 2002

Stress tunable tantalum and tantalum nitride films

APPLIED MATERIALS INC30 citations92
US6313033B1Nov 6, 2001

Ionized metal plasma Ta, TaNx, W, and WNx liners for gate electrode applications

APPLIED MATERIALS INC33 citations92

INTERMOLECULAR INC

10 patents

WANG YUN

4 patents

CHIANG TONY

4 patents

PHATAK PRASHANT

2 patents

KUMAR PRAGATI

2 patents

MILLER MICHAEL

2 patents

KUMAR NITIN

2 patents

MALHOTRA SANDRA G

1 patent

UNIVESITY OF CALIFORNIA

1 patent

SHANKER SUNIL

1 patent

Showing the top 50 of 111 patents by PatentIndex Score.