Inventor
WANG HSIEN-SHOU
TW7 patents
⚠️ This page may combine multiple inventors who share the name “WANG HSIEN-SHOU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
PHOENIX PREC TECHNOLOGY CORP
3 patentsUS7626270B2Dec 1, 2009
Coreless package substrate with conductive structures
PHOENIX PREC TECHNOLOGY CORP21 citations92
US7435618B2Oct 14, 2008
Method to manufacture a coreless packaging substrate
PHOENIX PREC TECHNOLOGY CORP8 citations73
US7419850B2Sep 2, 2008
Method to manufacture a coreless packaging substrate
PHOENIX PREC TECHNOLOGY CORP4 citations62
UNIMICRON TECHNOLOGY CORP
3 patentsUS7906850B2Mar 15, 2011
Structure of circuit board and method for fabricating same
UNIMICRON TECHNOLOGY CORP19 citations90
US7820233B2Oct 26, 2010
Method for fabricating a flip chip substrate structure
UNIMICRON TECHNOLOGY CORP13 citations83
US7867888B2Jan 11, 2011
Flip-chip package substrate and a method for fabricating the same
UNIMICRON TECHNOLOGY CORP3 citations60