Inventor
HILL RICHARD F
US30 patents
⚠️ This page may combine multiple inventors who share the name “HILL RICHARD F”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAIRD TECHNOLOGIES INC
15 patentsUS9222735B2Dec 29, 2015
Compliant multilayered thermally-conductive interface assemblies
LAIRD TECHNOLOGIES INC20 citations91
US7965514B2Jun 21, 2011
Assemblies and methods for dissipating heat from handheld electronic devices
LAIRD TECHNOLOGIES INC41 citations91
US7765811B2Aug 3, 2010
Flexible assemblies with integrated thermoelectric modules suitable for use in extracting power from or dissipating heat from fluid conduits
LAIRD TECHNOLOGIES INC33 citations87
US10600714B2Mar 24, 2020
Methods for establishing thermal joints between heat spreaders or lids and heat sources
LAIRD TECHNOLOGIES INC4 citations84
US9330998B2May 3, 2016
Thermal interface material assemblies and related methods
LAIRD TECHNOLOGIES INC15 citations84
US9322580B2Apr 26, 2016
Circuit assemblies including thermoelectric modules
LAIRD TECHNOLOGIES INC10 citations82
US11610831B2Mar 21, 2023
Methods for establishing thermal joints between heat spreaders or lids and heat sources
LAIRD TECHNOLOGIES INC1 citations73
US10964617B2Mar 30, 2021
Methods for establishing thermal joints between heat spreaders or lids and heat sources
LAIRD TECHNOLOGIES INC2 citations73
US10373891B2Aug 6, 2019
Methods for establishing thermal joints between heat spreaders or lids and heat sources
LAIRD TECHNOLOGIES INC3 citations73
US9515004B2Dec 6, 2016
Thermal interface materials
LAIRD TECHNOLOGIES INC3 citations72
US9258928B2Feb 9, 2016
Assemblies and methods for dissipating heat from handheld electronic devices
LAIRD TECHNOLOGIES INC4 citations71
US11776928B2Oct 3, 2023
Compressible foamed thermal interface materials and methods of making the same
LAIRD TECHNOLOGIES INC1 citations69
US11276662B2Mar 15, 2022
Compressible foamed thermal interface materials and methods of making the same
LAIRD TECHNOLOGIES INC2 citations69
US11776868B2Oct 3, 2023
Methods for establishing thermal joints between heat spreaders or lids and heat sources
LAIRD TECHNOLOGIES INC0 citations62
US12033971B2Jul 9, 2024
Compressible foamed thermal interface materials and methods of making the same
LAIRD TECHNOLOGIES INC0 citations59
UNION CARBIDE CORP
4 patentsUS4242271ADec 30, 1980
Process for preparing aluminum alkoxides
UNION CARBIDE CORP192 citations96
US4835298AMay 30, 1989
Method for producing liquid alkoxides of mixed metals
UNION CARBIDE CORP16 citations72
US4288410ASep 8, 1981
Apparatus for preparing aluminum alkoxides
UNION CARBIDE CORP9 citations70
US4946976AAug 7, 1990
Cordierite composition and method of production
UNION CARBIDE CORP2 citations61
THERMAGON INC
3 patentsUS6372997B1Apr 16, 2002
Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink
THERMAGON INC95 citations96
US6761928B2Jul 13, 2004
Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink
THERMAGON INC38 citations94
US6617517B2Sep 9, 2003
Multi-layer structure having a thermal interface with low contact resistance between a microelectronic component package and a heat sink
THERMAGON INC32 citations92
HILL RICHARD F
3 patentsUS8081468B2Dec 20, 2011
Memory modules including compliant multilayered thermally-conductive interface assemblies
HILL RICHARD F44 citations95
US8837151B2Sep 16, 2014
Memory modules including compliant multilayered thermally-conductive interface assemblies
HILL RICHARD F21 citations90
US8477499B2Jul 2, 2013
Assemblies and methods for dissipating heat from handheld electronic devices
HILL RICHARD F29 citations90