Inventor
LIU DON-GEY
TW2 patents
Patents
2 patentsUS6838116B2Jan 4, 2005
Oxygen-removing pre-process for copper interconnect grown by electrochemical displacement deposition
UNIV FENG CHIA1 citations41
US7141269B2Nov 28, 2006
Molding technique for copper interconnecting wires by electrochemical displacement deposition on the pre-shaped metal layer
UNIV FENG CHIA0 citations30