Inventor

HSU HONG-YUAN

TW2 patents

⚠️ This page may combine multiple inventors who share the name “HSU HONG-YUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ROWAN CO INC

1 patent

US10920389B2Feb 16, 2021

Multi-stage coming off location technology

ROWAN CO INC0 citations41

UNIV FENG CHIA

1 patent

US7141269B2Nov 28, 2006

Molding technique for copper interconnecting wires by electrochemical displacement deposition on the pre-shaped metal layer

UNIV FENG CHIA0 citations30