Inventor

CHOI JIN-HAK

KR3 patents

⚠️ This page may combine multiple inventors who share the name “CHOI JIN-HAK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

2 patents

US7132358B2Nov 7, 2006

Method of forming solder bump with reduced surface defects

SAMSUNG ELECTRONICS CO LTD5 citations72

US7553751B2Jun 30, 2009

Method of forming solder bump with reduced surface defects

SAMSUNG ELECTRONICS CO LTD3 citations61

SAMSUNG ELECTRO MECH

1 patent

US7982138B2Jul 19, 2011

Method of nickel-gold plating and printed circuit board

SAMSUNG ELECTRO MECH0 citations45