Inventor
SHIH CHIH-YUAN
TW6 patents
Patents
6 patentsUS9754868B2Sep 5, 2017
Substrate structure, electronic package and method for fabricating the electronic package
SILICONWARE PRECISION INDUSTRIES CO LTD8 citations81
US9058971B2Jun 16, 2015
Electro-optical module
SILICONWARE PRECISION INDUSTRIES CO LTD7 citations81
US11476572B2Oct 18, 2022
Method for fabricating electronic package structure
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations60
US10587041B2Mar 10, 2020
Electronic package structure and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations60
US11437325B2Sep 6, 2022
Electronic device, electronic package and packaging substrate thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations59
US10096541B2Oct 9, 2018
Method for fabricating electronic package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49