P

Inventor

HUANG JUNG-PIN

TW10 patents
⚠️ This page may combine multiple inventors who share the name “HUANG JUNG-PIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SILICONWARE PRECISION INDUSTRIES CO LTD

8 patents
US7193309B2Mar 20, 2007

Semiconductor package with stacked chips and method for fabricating the same

SILICONWARE PRECISION INDUSTRIES CO LTD24 citations91
US9058971B2Jun 16, 2015

Electro-optical module

SILICONWARE PRECISION INDUSTRIES CO LTD7 citations81
US6737737B1May 18, 2004

Semiconductor package with chip supporting member

SILICONWARE PRECISION INDUSTRIES CO LTD9 citations73
US7102218B2Sep 5, 2006

Semiconductor package with chip supporting structure

SILICONWARE PRECISION INDUSTRIES CO LTD7 citations68
US9754927B2Sep 5, 2017

Method for fabricating multi-chip stack structure

SILICONWARE PRECISION INDUSTRIES CO LTD1 citations51
US8802507B2Aug 12, 2014

Fabrication method of semiconductor package device, and fabrication method of semiconductor package structure

SILICONWARE PRECISION INDUSTRIES CO LTD1 citations51
US7981729B2Jul 19, 2011

Fabrication method of multi-chip stack structure

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US7655503B2Feb 2, 2010

Method for fabricating semiconductor package with stacked chips

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51

LIU CHUNG-LUN

1 patent
US8896130B2Nov 25, 2014

Multi-chip stack structure and method for fabricating the same

LIU CHUNG-LUN6 citations78

CHIANG CHENG-CHIA

1 patent
US8304891B2Nov 6, 2012

Semiconductor package device, semiconductor package structure, and fabrication methods thereof

CHIANG CHENG-CHIA5 citations57