Inventor
CHEN HSIEN-WEN
TW13 patents
⚠️ This page may combine multiple inventors who share the name “CHEN HSIEN-WEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICONWARE PRECISION INDUSTRIES CO LTD
11 patentsUS9502335B2Nov 22, 2016
Package structure and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD13 citations83
US9818683B2Nov 14, 2017
Electronic package and method of fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD9 citations82
US9058971B2Jun 16, 2015
Electro-optical module
SILICONWARE PRECISION INDUSTRIES CO LTD7 citations81
US10199320B2Feb 5, 2019
Method of fabricating electronic package
SILICONWARE PRECISION INDUSTRIES CO LTD4 citations71
US9875949B2Jan 23, 2018
Electronic package having circuit structure with plurality of metal layers, and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD5 citations71
US10049973B2Aug 14, 2018
Electronic package and fabrication method thereof and substrate structure
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US9196596B2Nov 24, 2015
Interposer and method of manufacturing the same
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US9748183B2Aug 29, 2017
Fabrication method of semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49
US9627307B2Apr 18, 2017
Semiconductor package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations49
US10403596B2Sep 3, 2019
Method of fabricating packaging structure
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations41
US10249562B2Apr 2, 2019
Package structure and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations41