Inventor

PAO CHIH-MIN

TW3 patents

Patents

3 patents

US6503776B2Jan 7, 2003

Method for fabricating stacked chip package

ADVANCED SEMICONDUCTOR ENG75 citations95

US6967403B2Nov 22, 2005

Package structure with a heat spreader and manufacturing method thereof

ADVANCED SEMICONDUCTOR ENG72 citations94

US6691876B2Feb 17, 2004

Semiconductor wafer cassette

ADVANCED SEMICONDUCTOR ENG21 citations89