Inventor
CHIN IAN EN YOON
MY4 patents
Patents
4 patentsUS11322457B2May 3, 2022
Control of warpage using ABF GC cavity for embedded die package
INTEL CORP2 citations70
US12009318B2Jun 11, 2024
Control of warpage using ABF GC cavity for embedded die package
INTEL CORP0 citations59
US9941219B2Apr 10, 2018
Control of warpage using ABF GC cavity for embedded die package
INTEL CORP1 citations55
US10658307B2May 19, 2020
Control of warpage using ABF GC cavity for embedded die package
INTEL CORP0 citations45