Inventor · disambiguated record
Walid M. Meliane
Also filed as: MELIANE WALID · MELIANE WALID M
7 granted patents·3 pending applications·22 citations·filing 2015–2024
79Inventor score
Technology areasH10W
Top patents by PatentIndex Score
10 records- 0185US9659898B1Apparatuses, systems, and methods for die attach coatings for semiconductor packagesTRIQUINT SEMICONDUCTOR INC·Filed 2015·Granted May 23, 2017·6 cites·19 claims
- 0284US9974158B2Air-cavity package with two heat dissipation interfacesQORVO US INC·Filed 2017·Granted May 15, 2018·5 cites·21 claims
- 0383US10015882B1Modular semiconductor packageTRIQUINT SEMICONDUCTOR INC·Filed 2015·Granted Jul 3, 2018·6 cites·10 claims
- 0479US10390434B2Laminate-based package with internal overmoldQORVO US INC·Filed 2018·Granted Aug 20, 2019·3 cites·20 claims
- 0575US9991181B2Air-cavity package with enhanced package integration level and thermal performanceQORVO US INC·Filed 2017·Granted Jun 5, 2018·2 cites·21 claims
- 0660US2025015053A1Bare flip-chip die stack and the fabrication method and tooling thereofQORVO US INC·Filed 2024·Application pending·0 cites
- 0751US2023178467A1Die attach systemQORVO US INC·Filed 2022·Application pending·0 cites
- 0850US11877505B2Fluorinated polymers with low dielectric loss for environmental protection in semiconductor devicesQORVO US INC·Filed 2021·Granted Jan 16, 2024·0 cites·16 claims
- 0950US10217686B2Air-cavity package with enhanced package integration level and thermal performanceQORVO US INC·Filed 2018·Granted Feb 26, 2019·0 cites·17 claims
- 1047US2023343662A1Molding compound thermal enhancement utilizing graphene or graphite materialsQORVO US INC·Filed 2023·Application pending·0 cites
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