P

Inventor

HUANG GUANGYU

US36 patents
⚠️ This page may combine multiple inventors who share the name “HUANG GUANGYU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MICRON TECHNOLOGY INC

22 patents
US9741737B1Aug 22, 2017

Integrated structures comprising vertical channel material and having conductively-doped semiconductor material directly against lower sidewalls of the channel material

MICRON TECHNOLOGY INC105 citations99
US10418379B2Sep 17, 2019

Integrated structures comprising channel material extending into source material

MICRON TECHNOLOGY INC12 citations93
US9941298B2Apr 10, 2018

Methods of forming integrated structures comprising vertical channel material and having conductively-doped semiconductor material directly against lower sidewalls of the channel material

MICRON TECHNOLOGY INC14 citations93
US10608012B2Mar 31, 2020

Memory devices including memory cells and related methods

MICRON TECHNOLOGY INC8 citations84
US11937423B2Mar 19, 2024

Memory array and methods used in forming a memory array

MICRON TECHNOLOGY INC2 citations73
US11569266B2Jan 31, 2023

Integrated structures comprising vertical channel material and having conductively-doped semiconductor material directly against lower sidewalls of the channel material

MICRON TECHNOLOGY INC2 citations73
US11018255B2May 25, 2021

Devices and systems with string drivers including high band gap material and methods of formation

MICRON TECHNOLOGY INC4 citations73
US10170194B1Jan 1, 2019

Asymmetrical multi-gate string driver for memory device

MICRON TECHNOLOGY INC4 citations73
US10381365B2Aug 13, 2019

Integrated structures containing vertically-stacked memory cells

MICRON TECHNOLOGY INC3 citations72
US11908948B2Feb 20, 2024

Memory devices including indium-containing materials, and related electronic systems

MICRON TECHNOLOGY INC0 citations63
US11430895B2Aug 30, 2022

Transistors including oxide semiconductive materials, and related microelectronic devices, memory devices, electronic systems, and methods

MICRON TECHNOLOGY INC1 citations63
US11024643B2Jun 1, 2021

Methods of forming integrated structures comprising vertical channel material and having conductively-doped semiconductor material directly against lower sidewalls of the channel material

MICRON TECHNOLOGY INC0 citations63
US12274056B2Apr 8, 2025

Memory array and methods used in forming a memory array

MICRON TECHNOLOGY INC0 citations62
US11527620B2Dec 13, 2022

Integrated assemblies having polycrystalline first semiconductor material adjacent conductively-doped second semiconductor material

MICRON TECHNOLOGY INC0 citations62
US11380699B2Jul 5, 2022

Memory array and methods used in forming a memory array

MICRON TECHNOLOGY INC0 citations62
US11309321B2Apr 19, 2022

Integrated structures containing vertically-stacked memory cells

MICRON TECHNOLOGY INC0 citations62
US11107832B2Aug 31, 2021

Apparatuses including memory cells and related methods

MICRON TECHNOLOGY INC0 citations62
US11038027B2Jun 15, 2021

Integrated assemblies having polycrystalline first semiconductor material adjacent conductively-doped second semiconductor material

MICRON TECHNOLOGY INC0 citations62
US10892268B2Jan 12, 2021

Integrated structures containing vertically-stacked memory cells

MICRON TECHNOLOGY INC0 citations62
US10734399B2Aug 4, 2020

Multi-gate string drivers having shared pillar structure

MICRON TECHNOLOGY INC1 citations62
US12310010B2May 20, 2025

Transistors with raised extension regions and semiconductor fins

MICRON TECHNOLOGY INC0 citations52
US10777281B2Sep 15, 2020

Asymmetrical multi-gate string driver for memory device

MICRON TECHNOLOGY INC0 citations52

INTEL CORP

6 patents

Intel NDTM US LLC

3 patents

LODESTAR LICENSING GROUP LLC

2 patents

GLOBALFOUNDRIES SG PTE LTD

1 patent

ENSHI TUJIA AND MIAO AUTONOMOUS PREFECTURE ACAD OF AGRICULTURAL SCIENCES ENSHI TUJIA

1 patent

YIN CHUNSHAN

1 patent