Inventor
HUANG GUANGYU
US36 patents
⚠️ This page may combine multiple inventors who share the name “HUANG GUANGYU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
22 patentsUS9741737B1Aug 22, 2017
Integrated structures comprising vertical channel material and having conductively-doped semiconductor material directly against lower sidewalls of the channel material
MICRON TECHNOLOGY INC105 citations99
US10418379B2Sep 17, 2019
Integrated structures comprising channel material extending into source material
MICRON TECHNOLOGY INC12 citations93
US9941298B2Apr 10, 2018
Methods of forming integrated structures comprising vertical channel material and having conductively-doped semiconductor material directly against lower sidewalls of the channel material
MICRON TECHNOLOGY INC14 citations93
US10608012B2Mar 31, 2020
Memory devices including memory cells and related methods
MICRON TECHNOLOGY INC8 citations84
US11937423B2Mar 19, 2024
Memory array and methods used in forming a memory array
MICRON TECHNOLOGY INC2 citations73
US11569266B2Jan 31, 2023
Integrated structures comprising vertical channel material and having conductively-doped semiconductor material directly against lower sidewalls of the channel material
MICRON TECHNOLOGY INC2 citations73
US11018255B2May 25, 2021
Devices and systems with string drivers including high band gap material and methods of formation
MICRON TECHNOLOGY INC4 citations73
US10170194B1Jan 1, 2019
Asymmetrical multi-gate string driver for memory device
MICRON TECHNOLOGY INC4 citations73
US10381365B2Aug 13, 2019
Integrated structures containing vertically-stacked memory cells
MICRON TECHNOLOGY INC3 citations72
US11908948B2Feb 20, 2024
Memory devices including indium-containing materials, and related electronic systems
MICRON TECHNOLOGY INC0 citations63
US11430895B2Aug 30, 2022
Transistors including oxide semiconductive materials, and related microelectronic devices, memory devices, electronic systems, and methods
MICRON TECHNOLOGY INC1 citations63
US11024643B2Jun 1, 2021
Methods of forming integrated structures comprising vertical channel material and having conductively-doped semiconductor material directly against lower sidewalls of the channel material
MICRON TECHNOLOGY INC0 citations63
US12274056B2Apr 8, 2025
Memory array and methods used in forming a memory array
MICRON TECHNOLOGY INC0 citations62
US11527620B2Dec 13, 2022
Integrated assemblies having polycrystalline first semiconductor material adjacent conductively-doped second semiconductor material
MICRON TECHNOLOGY INC0 citations62
US11380699B2Jul 5, 2022
Memory array and methods used in forming a memory array
MICRON TECHNOLOGY INC0 citations62
US11309321B2Apr 19, 2022
Integrated structures containing vertically-stacked memory cells
MICRON TECHNOLOGY INC0 citations62
US11107832B2Aug 31, 2021
Apparatuses including memory cells and related methods
MICRON TECHNOLOGY INC0 citations62
US11038027B2Jun 15, 2021
Integrated assemblies having polycrystalline first semiconductor material adjacent conductively-doped second semiconductor material
MICRON TECHNOLOGY INC0 citations62
US10892268B2Jan 12, 2021
Integrated structures containing vertically-stacked memory cells
MICRON TECHNOLOGY INC0 citations62
US10734399B2Aug 4, 2020
Multi-gate string drivers having shared pillar structure
MICRON TECHNOLOGY INC1 citations62
US12310010B2May 20, 2025
Transistors with raised extension regions and semiconductor fins
MICRON TECHNOLOGY INC0 citations52
US10777281B2Sep 15, 2020
Asymmetrical multi-gate string driver for memory device
MICRON TECHNOLOGY INC0 citations52
INTEL CORP
6 patentsUS9412821B2Aug 9, 2016
Stacked thin channels for boost and leakage improvement
INTEL CORP15 citations91
US9209199B2Dec 8, 2015
Stacked thin channels for boost and leakage improvement
INTEL CORP25 citations91
US9281318B2Mar 8, 2016
Three dimensional memory structure
INTEL CORP6 citations84
US9129859B2Sep 8, 2015
Three dimensional memory structure
INTEL CORP12 citations84
US10290642B2May 14, 2019
Flash memory devices incorporating a polydielectric layer
INTEL CORP2 citations70
US10903219B2Jan 26, 2021
Method for making a flash memory device
INTEL CORP0 citations60
Intel NDTM US LLC
3 patentsUS12089412B2Sep 10, 2024
Vertical string driver with extended gate junction structure
Intel NDTM US LLC0 citations62
US12484225B2Nov 25, 2025
Metal hybrid charge storage structure for memory
Intel NDTM US LLC0 citations57
US12148802B2Nov 19, 2024
Vertical string driver with channel field management structure
Intel NDTM US LLC0 citations51
LODESTAR LICENSING GROUP LLC
2 patentsUS12029039B2Jul 2, 2024
Integrated structures comprising vertical channel material and having conductively-doped semiconductor material directly against lower sidewalls of the channel material
LODESTAR LICENSING GROUP LLC0 citations63
US12219772B2Feb 4, 2025
Multi-gate string drivers having shared pillar structure
LODESTAR LICENSING GROUP LLC0 citations62