Inventor
TUOZZOLO VITO J
US3 patents
Patents
3 patentsUS5490040AFeb 6, 1996
Surface mount chip package having an array of solder ball contacts arranged in a circle and conductive pin contacts arranged outside the circular array
IBM162 citations97
US5032897AJul 16, 1991
Integrated thermoelectric cooling
IBM74 citations94
US5012325AApr 30, 1991
Thermoelectric cooling via electrical connections
IBM51 citations90