Inventor

KUECHENMEISTER FRANK

DE31 patents

⚠️ This page may combine multiple inventors who share the name “KUECHENMEISTER FRANK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KUECHENMEISTER FRANK

ADVANCED MICRO DEVICES INC

Solder bump structure and a method of forming the same

Semiconductor device with gel-type thermal interface material

Semiconductor substrate thinning method for manufacturing thinned die

Soft error resistant semiconductor device

Semiconductor chip with reinforcement layer and method of making the same

Technique for efficiently patterning an underbump metallization layer using a dry etch process

Technique for enhancing thermal and mechanical characteristics of an underfill material of a substrate/die assembly

Technique for forming a copper-based contact layer without a terminal metal

Semiconductor device including a reduced stress configuration for metal pillars

Efficient method of forming and assembling a microelectronic chip including solder bumps

System for driving and controlling a movable electrode assembly in an electrochemical process tool

System and method for controlling an electrochemical etch process

GLOBALFOUNDRIES INC

Method for decreasing surface delamination of gel-type thermal interface material by management of the material cure temperature

Wire bonding on reactive metal surfaces of a metallization of a semiconductor device by providing a protective layer

Pillar structure for use in packaging integrated circuit products and methods of making such a pillar structure

Method for forming solder balls with a stable oxide layer by controlling the reflow ambient

Semiconductor dies with reduced area consumption

Articles including bonded metal structures and methods of preparing the same

Back side metallization with superior adhesion in high-performance semiconductor devices

LEHR MATTHIAS

Semiconductor device including a die region designed for aluminum-free solder bump connection and a test structure designed for aluminum-free wire bonding

Method and device for fabricating bonding wires on the basis of microelectronic manufacturing techniques

Wire bonding on reactive metal surfaces of a metallization of a semiconductor device by providing a protection layer

SU MICHAEL Z

Integrated circuit package having offset vias

KUECHENMEISTER FRANK

Methods of forming bump structures that include a protection layer

GLOBALFOUNDRIES US INC

Photonics chips with an edge coupler and a continuous crackstop

GEISLER HOLM

Assessing metal stack integrity in sophisticated semiconductor devices by mechanically stressing die contacts

ZHANG ZHEN

Semiconductor device having a filled trench structure and methods for fabricating the same

RICHTER DANIEL

Substrate dicing technique for separating semiconductor dies with reduced area consumption

SCHULZE THOMAS

Conductive connection structure with stress reduction arrangement for a semiconductor device, and related fabrication method

GRILLBERGER MICHAEL

Assessing thermal mechanical characteristics of complex semiconductor devices by integrated heating systems

LETZ TOBIAS

Technique for forming a passivation layer without a terminal metal