Inventor
KLEWER CHRISTIAN
DE4 patents
Patents
4 patentsUS9536848B2Jan 3, 2017
Bond pad structure for low temperature flip chip bonding
GLOBALFOUNDRIES INC219 citations96
US10068835B2Sep 4, 2018
Process flow for a combined CA and TSV oxide deposition
GLOBALFOUNDRIES INC0 citations46
US9659840B2May 23, 2017
Process flow for a combined CA and TSV oxide deposition
GLOBALFOUNDRIES INC0 citations46
US9570430B2Feb 14, 2017
Articles including bonded metal structures and methods of preparing the same
GLOBALFOUNDRIES INC0 citations37