Inventor
CHEN CHI-YUAN
TW41 patents
⚠️ This page may combine multiple inventors who share the name “CHEN CHI-YUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
9 patentsUS10157995B2Dec 18, 2018
Integrating junction formation of transistors with contact formation
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US9978583B2May 22, 2018
Opening fill process and structures formed thereby
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9624576B2Apr 18, 2017
Systems and methods for gap filling improvement
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11444028B2Sep 13, 2022
Contact structure and formation thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US9627313B2Apr 18, 2017
Opening fill process and structure formed thereby
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US10283359B2May 7, 2019
Systems and methods for gap filling improvement
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10510664B2Dec 17, 2019
Contact structure and formation thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9735107B2Aug 15, 2017
Contact structure and formation thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9508716B2Nov 29, 2016
Methods of manufacturing a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations41
TAIWAN SEMICONDUCTOR MFG
8 patentsUS8889497B2Nov 18, 2014
Semiconductor devices and methods of manufacture thereof
TAIWAN SEMICONDUCTOR MFG22 citations92
US9287170B2Mar 15, 2016
Contact structure and formation thereof
TAIWAN SEMICONDUCTOR MFG8 citations83
US9048087B2Jun 2, 2015
Methods for wet clean of oxide layers over epitaxial layers
TAIWAN SEMICONDUCTOR MFG8 citations83
US9245797B2Jan 26, 2016
Opening fill process and structure formed thereby
TAIWAN SEMICONDUCTOR MFG4 citations73
US8927418B1Jan 6, 2015
Systems and methods for reducing contact resistivity of semiconductor devices
TAIWAN SEMICONDUCTOR MFG5 citations73
US9153657B2Oct 6, 2015
Semiconductor devices comprising a fin
TAIWAN SEMICONDUCTOR MFG2 citations62
US9064959B2Jun 23, 2015
Method and apparatus for forming a CMOS device
TAIWAN SEMICONDUCTOR MFG0 citations51
US8853083B2Oct 7, 2014
Chemical mechanical polish in the growth of semiconductor regions
TAIWAN SEMICONDUCTOR MFG0 citations51
MEDIATEK INC
8 patentsUS11227846B2Jan 18, 2022
Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure
MEDIATEK INC7 citations84
US10756040B2Aug 25, 2020
Semiconductor package with rigid under bump metallurgy (UBM) stack
MEDIATEK INC4 citations73
US11302657B2Apr 12, 2022
Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure
MEDIATEK INC1 citations71
US11967570B2Apr 23, 2024
Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure
MEDIATEK INC0 citations61
US11705413B2Jul 18, 2023
Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure
MEDIATEK INC0 citations61
US12080614B2Sep 3, 2024
Lidded semiconductor package
MEDIATEK INC0 citations60
US12588522B2Mar 24, 2026
Semiconductor package structure
MEDIATEK INC0 citations59
US12388194B2Aug 12, 2025
Antenna-in-module package-on-package with air trenches
MEDIATEK INC0 citations58
CHEN CHI-YUAN
5 patentsUS8720014B2May 13, 2014
Trigger grip
CHEN CHI-YUAN15 citations83
US8720013B2May 13, 2014
Trigger grip
CHEN CHI-YUAN9 citations83
USD645888SSep 27, 2011
Trigger grip
CHEN CHI-YUAN9 citations76
USD637635SMay 10, 2011
Trigger grip
CHEN CHI-YUAN5 citations62
USD637634SMay 10, 2011
Trigger grip
CHEN CHI-YUAN5 citations62