Inventor

TSAI CHUN-I

TW28 patents

⚠️ This page may combine multiple inventors who share the name “TSAI CHUN-I”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TSAI CHUN-I

TAIWAN SEMICONDUCTOR MFG CO LTD

Conductive feature formation and structure

Contact conductive feature formation and structure

Contact conductive feature formation and structure

Contact structure and the method of forming the same

Opening fill process and structures formed thereby

Systems and methods for gap filling improvement

Interconnect structures including a fin structure and a metal cap

Liner-free conductive structures

Method of forming conductive feature including cleaning step

Contact conductive feature formation and structure

Capping layer for liner-free conductive structures

Conductive feature formation and structure

Metal adhesion layer to promote metal plug adhesion

Method of forming conductive feature including cleaning step

Conductive feature formation and structure

Contact conductive feature formation and structure

Method of forming conductive feature including cleaning step

Liner-free conductive structures

Capping layer for liner-free conductive structures

Method for forming semiconductor contact structure

Conductive feature formation and structure

Opening fill process and structure formed thereby

Interconnect structure and manufacturing method for the same

Interconnect structure and manufacturing method for the same

Systems and methods for gap filling improvement

Gate to source drain interconnects

TAIWAN SEMICONDUCTOR MFG

Opening fill process and structure formed thereby

Method of integrated circuit fabrication