Inventor

HUANG HUANG-YI

TW41 patents

⚠️ This page may combine multiple inventors who share the name “HUANG HUANG-YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUANG HUANG-YI

TAIWAN SEMICONDUCTOR MFG CO LTD

Metal liner overhang reduction and manufacturing method thereof

Semiconductor devices and methods of forming same

Selective formation of titanium silicide and titanium nitride by hydrogen gas control

Wrap-around contact plug and method manufacturing same

Wrap-around contact plug and method manufacturing same

Semiconductor devices and methods of forming same

Method of making a silicide beneath a vertical structure

Vertical structure having an etch stop over portion of the source

Self-aligned repairing process for barrier layer

Systems and methods for gap filling improvement

Method for integrated circuit patterning

Plasma apparatus, magnetic-field controlling method, and semiconductor manufacturing method

Selective repairing process for barrier layer

Vertical-gate-all-around devices and method of fabrication thereof

Selective formation of titanium silicide and titanium nitride by hydrogen gas control

Formation method of interconnection structure of semiconductor device

Semiconductor device with low resistivity contact structure

Contact structure and formation thereof

Selective formation of titanium silicide and titanium nitride by hydrogen gas control

Selective formation of titanium silicide and titanium nitride by hydrogen gas control

Wrap-around contact plug and method manufacturing same

Conductive feature formation and structure

Wrap-around contact plug and method manufacturing same

Systems and methods for gap filling improvement

Method for forming semiconductor device structure

Metal capping process and processing platform thereof

Semiconductor device structure and method for forming the same

Vertical structure and method of forming semiconductor device

Structure and method for forming interconnect structure

Metal capping process and processing platform thereof

Contact structure and formation thereof

Contact structure and formation thereof

Semiconductor device with low resistivity contact structure and method for forming the same

TAIWAN SEMICONDUCTOR MFG

Structure and method for forming interconnect structure

Contact structure and formation thereof

Method for integrated circuit patterning

Self-aligned repairing process for barrier layer

Hard mask edge cover scheme

Vertical structure and method of forming semiconductor device

Interconnect structures and methods of forming same

Method for conductive film quality evaluation