Inventor · disambiguated record

Youko Murata

Also filed as: MURATA YOUKO

1 granted patent·1 citations·filing 2018–2018

16Inventor score

Technology areasH10W

Files withHenkel IP & Holding GmbH1

Top patents by PatentIndex Score

1 record

0164US10242923B2Formulations containing mixed resin systems and the use thereof for wafer-level underfill for 3D TSV packagesHenkel IP & Holding GmbH·Filed 2018·Granted Mar 26, 2019·1 cites·21 claims

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