Inventor
TOMIZAWA KATSUYA
JP14 patents
Patents
14 patentsUS11195638B2Dec 7, 2021
Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board
MITSUBISHI GAS CHEMICAL CO2 citations71
US10676579B2Jun 9, 2020
Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board
MITSUBISHI GAS CHEMICAL CO3 citations71
US9902851B2Feb 27, 2018
Resin composition, prepreg, laminate, and printed wiring board
MITSUBISHI GAS CHEMICAL CO4 citations71
US11769607B2Sep 26, 2023
Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board
MITSUBISHI GAS CHEMICAL CO0 citations61
US11718708B2Aug 8, 2023
Curable composition, prepreg, resin sheet, metal foil-clad laminate and printed wiring board
MITSUBISHI GAS CHEMICAL CO0 citations59
US11499005B2Nov 15, 2022
Curable composition, prepreg, resin sheet, metal foil-clad laminate and printed wiring board
MITSUBISHI GAS CHEMICAL CO0 citations59
US10703874B2Jul 7, 2020
Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them
MITSUBISHI GAS CHEMICAL CO1 citations59
US10550228B2Feb 4, 2020
Resin composition, prepreg, metal foil-clad laminate, and printed circuit board
MITSUBISHI GAS CHEMICAL CO1 citations58
US11702504B2Jul 18, 2023
Resin composition for printed wiring board, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board
MITSUBISHI GAS CHEMICAL CO1 citations57
US10815349B2Oct 27, 2020
Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board
MITSUBISHI GAS CHEMICAL CO0 citations50
US10717837B2Jul 21, 2020
Resin composition and prepreg, resin sheet, laminate, and printed circuit board comprising same
MITSUBISHI GAS CHEMICAL CO0 citations49
US10292260B2May 14, 2019
Insulating layer for printed circuit board and printed circuit board
MITSUBISHI GAS CHEMICAL CO0 citations49
US10138393B2Nov 27, 2018
Resin composition, prepreg, laminate, metal foil-clad laminate, and printed-wiring board
MITSUBISHI GAS CHEMICAL CO0 citations49
US10563029B2Feb 18, 2020
Resin composition and prepreg, resin sheet, laminate, and printed circuit board
MITSUBISHI GAS CHEMICAL CO0 citations40