Inventor

OGASHIWA TAKAAKI

JP24 patents

⚠️ This page may combine multiple inventors who share the name “OGASHIWA TAKAAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

OGASHIWA TAKAAKI

MITSUBISHI GAS CHEMICAL CO

Lubricant material for assisting machining process and machining method

Resin composition, pre-preg, laminate, metal foil-clad laminate, and printed wiring board

Resin composition, prepreg, laminate, and printed wiring board

Support and method for producing semiconductor device-mounting substrate using the same

Method for producing laminate having patterned metal foil, and laminate having patterned metal foil

Supporting substrate, supporting substrate-attached laminate and method for manufacturing a package substrate for mounting a semiconductor device

Resin composition, prepreg, resin sheet, laminate, metal foil-clad laminate, and printed wiring board

Entry sheet for drilling and method for drilling processing using same

Entry sheet for drilling

Entry sheet for drilling and method for drilling processing using same

Entry sheet for drilling and method for drilling processing using same

Resin composition, prepreg, and laminated sheet

Method for producing package substrate for mounting semiconductor device

Method for producing package substrate for loading semiconductor device

Laminate, metal foil-clad laminate, laminate having patterned metal foil, laminate having buildup structure, printed wiring board, multilayer coreless substrate, and method for producing same

Methods for producing laminate and substrate for mounting a semiconductor device

Method for producing printed wiring board

Drill bit and hole formation method

Method for manufacturing package substrate for mounting a semiconductor device, and method for manufacturing semiconductor device mounting substrate

Resin composition for printed wiring board material and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using the same

OGASHIWA TAKAAKI

Resin composition, prepreg, and laminate

Resin composition, prepreg, and laminated sheet

MIYAHIRA TETSURO

Molybdenum compound powder, prepreg, and laminate

KATO YOSHIHIRO

Resin composition, prepreg and laminate