Inventor
BOUDREAUX BRENT A
US26 patents
⚠️ This page may combine multiple inventors who share the name “BOUDREAUX BRENT A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD DEVELOPMENT CO
23 patentsUS6816378B1Nov 9, 2004
Stack up assembly
HEWLETT PACKARD DEVELOPMENT CO40 citations96
US6771507B1Aug 3, 2004
Power module for multi-chip printed circuit boards
HEWLETT PACKARD DEVELOPMENT CO55 citations96
US6540531B2Apr 1, 2003
Clamp system for high speed cable termination
HEWLETT PACKARD DEVELOPMENT CO159 citations96
US6819562B2Nov 16, 2004
Cooling apparatus for stacked components
HEWLETT PACKARD DEVELOPMENT CO57 citations95
US7345885B2Mar 18, 2008
Heat spreader with multiple stacked printed circuit boards
HEWLETT PACKARD DEVELOPMENT CO38 citations92
US7286352B2Oct 23, 2007
Thermally expanding base of heatsink to receive fins
HEWLETT PACKARD DEVELOPMENT CO28 citations92
US7096926B2Aug 29, 2006
Thermal pouch interface
HEWLETT PACKARD DEVELOPMENT CO21 citations92
US6958445B1Oct 25, 2005
Electromagnetic interference shield for electronic devices on a circuit board
HEWLETT PACKARD DEVELOPMENT CO27 citations92
US6947286B2Sep 20, 2005
Stack up assembly
HEWLETT PACKARD DEVELOPMENT CO15 citations92
US7475175B2Jan 6, 2009
Multi-processor module
HEWLETT PACKARD DEVELOPMENT CO19 citations91
US6748458B2Jun 8, 2004
Modular input/output expansion system for an external computer
HEWLETT PACKARD DEVELOPMENT CO22 citations90
US6900987B2May 31, 2005
Stack up assembly
HEWLETT PACKARD DEVELOPMENT CO9 citations82
US6873530B2Mar 29, 2005
Stack up assembly
HEWLETT PACKARD DEVELOPMENT CO9 citations82
US6862186B2Mar 1, 2005
Stack up assembly
HEWLETT PACKARD DEVELOPMENT CO10 citations82
US6695042B1Feb 24, 2004
Adjustable pedestal thermal interface
HEWLETT PACKARD DEVELOPMENT CO14 citations82
US6625026B1Sep 23, 2003
Heat-activated self-aligning heat sink
HEWLETT PACKARD DEVELOPMENT CO17 citations82
US7028754B2Apr 18, 2006
High surface area heat sink
HEWLETT PACKARD DEVELOPMENT CO10 citations74
US6922340B2Jul 26, 2005
Stack up assembly
HEWLETT PACKARD DEVELOPMENT CO7 citations74
US6910271B2Jun 28, 2005
Mechanical highly compliant thermal interface pad
HEWLETT PACKARD DEVELOPMENT CO10 citations74
US6675720B2Jan 13, 2004
Management system for multiple cables
HEWLETT PACKARD DEVELOPMENT CO12 citations68
US7131199B2Nov 7, 2006
Mechanical highly compliant thermal interface pad
HEWLETT PACKARD DEVELOPMENT CO4 citations63
US7117929B2Oct 10, 2006
Heat sink
HEWLETT PACKARD DEVELOPMENT CO6 citations63
US7018215B2Mar 28, 2006
Routing system
HEWLETT PACKARD DEVELOPMENT CO1 citations51