Inventor
RYU JUNG-SU
KR3 patents
Patents
3 patentsUS7224176B2May 29, 2007
Semiconductor device having test element groups
SAMSUNG ELECTRONICS CO LTD16 citations79
US6949837B2Sep 27, 2005
Bonding pad arrangement method for semiconductor devices
SAMSUNG ELECTRONICS CO LTD4 citations61
US7429794B2Sep 30, 2008
Multi-chip packaged integrated circuit device for transmitting signals from one chip to another chip
SAMSUNG ELECTRONICS CO LTD3 citations60