P

Inventor

CHEN XINGLONG

US58 patents
⚠️ This page may combine multiple inventors who share the name “CHEN XINGLONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

APPLIED MATERIALS INC

35 patents
US9991134B2Jun 5, 2018

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC100 citations99
US9704723B2Jul 11, 2017

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC114 citations99
US9659792B2May 23, 2017

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC125 citations99
US9449850B2Sep 20, 2016

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC135 citations99
US9384997B2Jul 5, 2016

Dry-etch selectivity

APPLIED MATERIALS INC146 citations99
US9373517B2Jun 21, 2016

Semiconductor processing with DC assisted RF power for improved control

APPLIED MATERIALS INC137 citations99
US9362130B2Jun 7, 2016

Enhanced etching processes using remote plasma sources

APPLIED MATERIALS INC138 citations99
US9184055B2Nov 10, 2015

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC181 citations99
US9153442B2Oct 6, 2015

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC220 citations99
US9144147B2Sep 22, 2015

Semiconductor processing system and methods using capacitively coupled plasma

APPLIED MATERIALS INC188 citations99
US9093371B2Jul 28, 2015

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC184 citations99
US9023732B2May 5, 2015

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC187 citations99
US8969212B2Mar 3, 2015

Dry-etch selectivity

APPLIED MATERIALS INC184 citations99
US10032606B2Jul 24, 2018

Semiconductor processing with DC assisted RF power for improved control

APPLIED MATERIALS INC94 citations98
US9978564B2May 22, 2018

Chemical control features in wafer process equipment

APPLIED MATERIALS INC106 citations98
US9593421B2Mar 14, 2017

Particle generation suppressor by DC bias modulation

APPLIED MATERIALS INC63 citations98
US9132436B2Sep 15, 2015

Chemical control features in wafer process equipment

APPLIED MATERIALS INC198 citations98
US10354843B2Jul 16, 2019

Chemical control features in wafer process equipment

APPLIED MATERIALS INC40 citations97
US10062587B2Aug 28, 2018

Pedestal with multi-zone temperature control and multiple purge capabilities

APPLIED MATERIALS INC96 citations96
US9267739B2Feb 23, 2016

Pedestal with multi-zone temperature control and multiple purge capabilities

APPLIED MATERIALS INC52 citations96
US10256079B2Apr 9, 2019

Semiconductor processing systems having multiple plasma configurations

APPLIED MATERIALS INC42 citations94
US9892888B2Feb 13, 2018

Particle generation suppresor by DC bias modulation

APPLIED MATERIALS INC26 citations94
US11024486B2Jun 1, 2021

Semiconductor processing systems having multiple plasma configurations

APPLIED MATERIALS INC6 citations84
US10504697B2Dec 10, 2019

Particle generation suppresor by DC bias modulation

APPLIED MATERIALS INC8 citations84
US10056233B2Aug 21, 2018

RPS assisted RF plasma source for semiconductor processing

APPLIED MATERIALS INC7 citations84
US9741545B2Aug 22, 2017

RPS assisted RF plasma source for semiconductor processing

APPLIED MATERIALS INC5 citations84
US9502218B2Nov 22, 2016

RPS assisted RF plasma source for semiconductor processing

APPLIED MATERIALS INC12 citations84
US7789993B2Sep 7, 2010

Internal balanced coil for inductively coupled high density plasma processing chamber

APPLIED MATERIALS INC8 citations84
US7572647B2Aug 11, 2009

Internal balanced coil for inductively coupled high density plasma processing chamber

APPLIED MATERIALS INC10 citations84
US10550472B2Feb 4, 2020

Flow control features of CVD chambers

APPLIED MATERIALS INC2 citations73
US10424485B2Sep 24, 2019

Enhanced etching processes using remote plasma sources

APPLIED MATERIALS INC2 citations73
US10170282B2Jan 1, 2019

Insulated semiconductor faceplate designs

APPLIED MATERIALS INC1 citations63
US12146219B2Nov 19, 2024

Flow control features of CVD chambers

APPLIED MATERIALS INC0 citations62
US11264213B2Mar 1, 2022

Chemical control features in wafer process equipment

APPLIED MATERIALS INC0 citations62
US7848076B2Dec 7, 2010

Method and apparatus for providing an electrostatic chuck with reduced plasma penetration and arcing

APPLIED MATERIALS INC3 citations59

PETROCHINA CO LTD

6 patents

SAMSUNG ELECTRONICS CO LTD

3 patents

CHUC KIEN N

1 patent

YANG JANG GYOO

1 patent

RASHEED MUHAMMAD M

1 patent

XINJIANG TECHNICAL INST OF PHYSICS & CHEMISTRY CHINESE ACADEMY OF SCIENCES

1 patent

LUBOMIRSKY DMITRY

1 patent

NARENDRNATH KADTHALA RAMAYA

1 patent

Showing the top 50 of 58 patents by PatentIndex Score.