Inventor
CHEN XINGLONG
US58 patents
⚠️ This page may combine multiple inventors who share the name “CHEN XINGLONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
35 patentsUS9991134B2Jun 5, 2018
Processing systems and methods for halide scavenging
APPLIED MATERIALS INC100 citations99
US9704723B2Jul 11, 2017
Processing systems and methods for halide scavenging
APPLIED MATERIALS INC114 citations99
US9659792B2May 23, 2017
Processing systems and methods for halide scavenging
APPLIED MATERIALS INC125 citations99
US9449850B2Sep 20, 2016
Processing systems and methods for halide scavenging
APPLIED MATERIALS INC135 citations99
US9384997B2Jul 5, 2016
Dry-etch selectivity
APPLIED MATERIALS INC146 citations99
US9373517B2Jun 21, 2016
Semiconductor processing with DC assisted RF power for improved control
APPLIED MATERIALS INC137 citations99
US9362130B2Jun 7, 2016
Enhanced etching processes using remote plasma sources
APPLIED MATERIALS INC138 citations99
US9184055B2Nov 10, 2015
Processing systems and methods for halide scavenging
APPLIED MATERIALS INC181 citations99
US9153442B2Oct 6, 2015
Processing systems and methods for halide scavenging
APPLIED MATERIALS INC220 citations99
US9144147B2Sep 22, 2015
Semiconductor processing system and methods using capacitively coupled plasma
APPLIED MATERIALS INC188 citations99
US9093371B2Jul 28, 2015
Processing systems and methods for halide scavenging
APPLIED MATERIALS INC184 citations99
US9023732B2May 5, 2015
Processing systems and methods for halide scavenging
APPLIED MATERIALS INC187 citations99
US8969212B2Mar 3, 2015
Dry-etch selectivity
APPLIED MATERIALS INC184 citations99
US10032606B2Jul 24, 2018
Semiconductor processing with DC assisted RF power for improved control
APPLIED MATERIALS INC94 citations98
US9978564B2May 22, 2018
Chemical control features in wafer process equipment
APPLIED MATERIALS INC106 citations98
US9593421B2Mar 14, 2017
Particle generation suppressor by DC bias modulation
APPLIED MATERIALS INC63 citations98
US9132436B2Sep 15, 2015
Chemical control features in wafer process equipment
APPLIED MATERIALS INC198 citations98
US10354843B2Jul 16, 2019
Chemical control features in wafer process equipment
APPLIED MATERIALS INC40 citations97
US10062587B2Aug 28, 2018
Pedestal with multi-zone temperature control and multiple purge capabilities
APPLIED MATERIALS INC96 citations96
US9267739B2Feb 23, 2016
Pedestal with multi-zone temperature control and multiple purge capabilities
APPLIED MATERIALS INC52 citations96
US10256079B2Apr 9, 2019
Semiconductor processing systems having multiple plasma configurations
APPLIED MATERIALS INC42 citations94
US9892888B2Feb 13, 2018
Particle generation suppresor by DC bias modulation
APPLIED MATERIALS INC26 citations94
US11024486B2Jun 1, 2021
Semiconductor processing systems having multiple plasma configurations
APPLIED MATERIALS INC6 citations84
US10504697B2Dec 10, 2019
Particle generation suppresor by DC bias modulation
APPLIED MATERIALS INC8 citations84
US10056233B2Aug 21, 2018
RPS assisted RF plasma source for semiconductor processing
APPLIED MATERIALS INC7 citations84
US9741545B2Aug 22, 2017
RPS assisted RF plasma source for semiconductor processing
APPLIED MATERIALS INC5 citations84
US9502218B2Nov 22, 2016
RPS assisted RF plasma source for semiconductor processing
APPLIED MATERIALS INC12 citations84
US7789993B2Sep 7, 2010
Internal balanced coil for inductively coupled high density plasma processing chamber
APPLIED MATERIALS INC8 citations84
US7572647B2Aug 11, 2009
Internal balanced coil for inductively coupled high density plasma processing chamber
APPLIED MATERIALS INC10 citations84
US10550472B2Feb 4, 2020
Flow control features of CVD chambers
APPLIED MATERIALS INC2 citations73
US10424485B2Sep 24, 2019
Enhanced etching processes using remote plasma sources
APPLIED MATERIALS INC2 citations73
US10170282B2Jan 1, 2019
Insulated semiconductor faceplate designs
APPLIED MATERIALS INC1 citations63
US12146219B2Nov 19, 2024
Flow control features of CVD chambers
APPLIED MATERIALS INC0 citations62
US11264213B2Mar 1, 2022
Chemical control features in wafer process equipment
APPLIED MATERIALS INC0 citations62
US7848076B2Dec 7, 2010
Method and apparatus for providing an electrostatic chuck with reduced plasma penetration and arcing
APPLIED MATERIALS INC3 citations59
PETROCHINA CO LTD
6 patentsUS12098783B2Sep 24, 2024
Gas flow control valve and mounting method for gas flow control valve
PETROCHINA CO LTD2 citations70
US11377941B2Jul 5, 2022
Gasflow distribution device, gas distributor, pipe string and method for separate-layer gas injection
PETROCHINA CO LTD0 citations55
US12038344B2Jul 16, 2024
Phase power device and fluid experiment system
PETROCHINA CO LTD0 citations48
US11098569B2Aug 24, 2021
System and method of performing oil displacement by water-gas dispersion system
PETROCHINA CO LTD0 citations48
US11344824B2May 31, 2022
Ultrasonic microbubble generation method, apparatus and system
PETROCHINA CO LTD0 citations47
US11179683B2Nov 23, 2021
Microbubble generation device and equipment
PETROCHINA CO LTD0 citations47
SAMSUNG ELECTRONICS CO LTD
3 patentsUS9768051B2Sep 19, 2017
Wafer clamping apparatus
SAMSUNG ELECTRONICS CO LTD2 citations71
US10529618B2Jan 7, 2020
Methods of manufacturing a semiconductor device
SAMSUNG ELECTRONICS CO LTD1 citations62
US9865474B2Jan 9, 2018
Etching method using plasma, and method of fabricating semiconductor device including the etching method
SAMSUNG ELECTRONICS CO LTD0 citations48
CHUC KIEN N
1 patentYANG JANG GYOO
1 patentRASHEED MUHAMMAD M
1 patentXINJIANG TECHNICAL INST OF PHYSICS & CHEMISTRY CHINESE ACADEMY OF SCIENCES
1 patentLUBOMIRSKY DMITRY
1 patentNARENDRNATH KADTHALA RAMAYA
1 patentShowing the top 50 of 58 patents by PatentIndex Score.