P

Inventor

VENKATARAMAN SHANKAR

US109 patents
⚠️ This page may combine multiple inventors who share the name “VENKATARAMAN SHANKAR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

APPLIED MATERIALS INC

41 patents
US9991134B2Jun 5, 2018

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC100 citations99
US9704723B2Jul 11, 2017

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC114 citations99
US9659792B2May 23, 2017

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC125 citations99
US9496167B2Nov 15, 2016

Integrated bit-line airgap formation and gate stack post clean

APPLIED MATERIALS INC132 citations99
US9449850B2Sep 20, 2016

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC135 citations99
US9373517B2Jun 21, 2016

Semiconductor processing with DC assisted RF power for improved control

APPLIED MATERIALS INC137 citations99
US9362130B2Jun 7, 2016

Enhanced etching processes using remote plasma sources

APPLIED MATERIALS INC138 citations99
US9209012B2Dec 8, 2015

Selective etch of silicon nitride

APPLIED MATERIALS INC173 citations99
US9184055B2Nov 10, 2015

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC181 citations99
US9153442B2Oct 6, 2015

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC220 citations99
US9144147B2Sep 22, 2015

Semiconductor processing system and methods using capacitively coupled plasma

APPLIED MATERIALS INC188 citations99
US9093371B2Jul 28, 2015

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC184 citations99
US9023732B2May 5, 2015

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC187 citations99
US8956980B1Feb 17, 2015

Selective etch of silicon nitride

APPLIED MATERIALS INC226 citations99
US6413583B1Jul 2, 2002

Formation of a liquid-like silica layer by reaction of an organosilicon compound and a hydroxyl forming compound

APPLIED MATERIALS INC725 citations99
US10032606B2Jul 24, 2018

Semiconductor processing with DC assisted RF power for improved control

APPLIED MATERIALS INC94 citations98
US9978564B2May 22, 2018

Chemical control features in wafer process equipment

APPLIED MATERIALS INC106 citations98
US9773695B2Sep 26, 2017

Integrated bit-line airgap formation and gate stack post clean

APPLIED MATERIALS INC113 citations98
US9728437B2Aug 8, 2017

High temperature chuck for plasma processing systems

APPLIED MATERIALS INC123 citations98
US9406523B2Aug 2, 2016

Highly selective doped oxide removal method

APPLIED MATERIALS INC135 citations98
US9378978B2Jun 28, 2016

Integrated oxide recess and floating gate fin trimming

APPLIED MATERIALS INC132 citations98
US9132436B2Sep 15, 2015

Chemical control features in wafer process equipment

APPLIED MATERIALS INC198 citations98
US7902080B2Mar 8, 2011

Deposition-plasma cure cycle process to enhance film quality of silicon dioxide

APPLIED MATERIALS INC55 citations98
US7500445B2Mar 10, 2009

Method and apparatus for cleaning a CVD chamber

APPLIED MATERIALS INC187 citations98
US6946033B2Sep 20, 2005

Heated gas distribution plate for a processing chamber

APPLIED MATERIALS INC227 citations98
US6797643B2Sep 28, 2004

Plasma enhanced CVD low k carbon-doped silicon oxide film deposition using VHF-RF power

APPLIED MATERIALS INC84 citations98
US6537733B2Mar 25, 2003

Method of depositing low dielectric constant silicon carbide layers

APPLIED MATERIALS INC292 citations98
US6486082B1Nov 26, 2002

CVD plasma assisted lower dielectric constant sicoh film

APPLIED MATERIALS INC80 citations98
US10354843B2Jul 16, 2019

Chemical control features in wafer process equipment

APPLIED MATERIALS INC40 citations97
US6890850B2May 10, 2005

Method of depositing dielectric materials in damascene applications

APPLIED MATERIALS INC92 citations97
US6387207B1May 14, 2002

Integration of remote plasma generator with semiconductor processing chamber

APPLIED MATERIALS INC944 citations97
US6374831B1Apr 23, 2002

Accelerated plasma clean

APPLIED MATERIALS INC642 citations97
US7087497B2Aug 8, 2006

Low-thermal-budget gapfill process

APPLIED MATERIALS INC54 citations96
US6591850B2Jul 15, 2003

Method and apparatus for fluid flow control

APPLIED MATERIALS INC68 citations96
US6913992B2Jul 5, 2005

Method of modifying interlayer adhesion

APPLIED MATERIALS INC34 citations95
US10256079B2Apr 9, 2019

Semiconductor processing systems having multiple plasma configurations

APPLIED MATERIALS INC42 citations94
US7935643B2May 3, 2011

Stress management for tensile films

APPLIED MATERIALS INC48 citations94
US6495233B1Dec 17, 2002

Apparatus for distributing gases in a chemical vapor deposition system

APPLIED MATERIALS INC77 citations93
US7226876B2Jun 5, 2007

Method of modifying interlayer adhesion

APPLIED MATERIALS INC14 citations92
US7200460B2Apr 3, 2007

Method of depositing low dielectric constant silicon carbide layers

APPLIED MATERIALS INC17 citations92
US7033945B2Apr 25, 2006

Gap filling with a composite layer

APPLIED MATERIALS INC43 citations92

CISCO TECH INC

2 patents

SAPRE KEDAR

1 patent

LIANG JINGMEI

1 patent

TANG JING

1 patent

BHATIA SIDHARTH

1 patent

CHUC KIEN N

1 patent

MANDREKAR TUSHAR V

1 patent

WANG LINLIN

1 patent

Showing the top 50 of 109 patents by PatentIndex Score.