Inventor
VENKATARAMAN SHANKAR
US109 patents
⚠️ This page may combine multiple inventors who share the name “VENKATARAMAN SHANKAR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
41 patentsUS9991134B2Jun 5, 2018
Processing systems and methods for halide scavenging
APPLIED MATERIALS INC100 citations99
US9704723B2Jul 11, 2017
Processing systems and methods for halide scavenging
APPLIED MATERIALS INC114 citations99
US9659792B2May 23, 2017
Processing systems and methods for halide scavenging
APPLIED MATERIALS INC125 citations99
US9496167B2Nov 15, 2016
Integrated bit-line airgap formation and gate stack post clean
APPLIED MATERIALS INC132 citations99
US9449850B2Sep 20, 2016
Processing systems and methods for halide scavenging
APPLIED MATERIALS INC135 citations99
US9373517B2Jun 21, 2016
Semiconductor processing with DC assisted RF power for improved control
APPLIED MATERIALS INC137 citations99
US9362130B2Jun 7, 2016
Enhanced etching processes using remote plasma sources
APPLIED MATERIALS INC138 citations99
US9209012B2Dec 8, 2015
Selective etch of silicon nitride
APPLIED MATERIALS INC173 citations99
US9184055B2Nov 10, 2015
Processing systems and methods for halide scavenging
APPLIED MATERIALS INC181 citations99
US9153442B2Oct 6, 2015
Processing systems and methods for halide scavenging
APPLIED MATERIALS INC220 citations99
US9144147B2Sep 22, 2015
Semiconductor processing system and methods using capacitively coupled plasma
APPLIED MATERIALS INC188 citations99
US9093371B2Jul 28, 2015
Processing systems and methods for halide scavenging
APPLIED MATERIALS INC184 citations99
US9023732B2May 5, 2015
Processing systems and methods for halide scavenging
APPLIED MATERIALS INC187 citations99
US8956980B1Feb 17, 2015
Selective etch of silicon nitride
APPLIED MATERIALS INC226 citations99
US6413583B1Jul 2, 2002
Formation of a liquid-like silica layer by reaction of an organosilicon compound and a hydroxyl forming compound
APPLIED MATERIALS INC725 citations99
US10032606B2Jul 24, 2018
Semiconductor processing with DC assisted RF power for improved control
APPLIED MATERIALS INC94 citations98
US9978564B2May 22, 2018
Chemical control features in wafer process equipment
APPLIED MATERIALS INC106 citations98
US9773695B2Sep 26, 2017
Integrated bit-line airgap formation and gate stack post clean
APPLIED MATERIALS INC113 citations98
US9728437B2Aug 8, 2017
High temperature chuck for plasma processing systems
APPLIED MATERIALS INC123 citations98
US9406523B2Aug 2, 2016
Highly selective doped oxide removal method
APPLIED MATERIALS INC135 citations98
US9378978B2Jun 28, 2016
Integrated oxide recess and floating gate fin trimming
APPLIED MATERIALS INC132 citations98
US9132436B2Sep 15, 2015
Chemical control features in wafer process equipment
APPLIED MATERIALS INC198 citations98
US7902080B2Mar 8, 2011
Deposition-plasma cure cycle process to enhance film quality of silicon dioxide
APPLIED MATERIALS INC55 citations98
US7500445B2Mar 10, 2009
Method and apparatus for cleaning a CVD chamber
APPLIED MATERIALS INC187 citations98
US6946033B2Sep 20, 2005
Heated gas distribution plate for a processing chamber
APPLIED MATERIALS INC227 citations98
US6797643B2Sep 28, 2004
Plasma enhanced CVD low k carbon-doped silicon oxide film deposition using VHF-RF power
APPLIED MATERIALS INC84 citations98
US6537733B2Mar 25, 2003
Method of depositing low dielectric constant silicon carbide layers
APPLIED MATERIALS INC292 citations98
US6486082B1Nov 26, 2002
CVD plasma assisted lower dielectric constant sicoh film
APPLIED MATERIALS INC80 citations98
US10354843B2Jul 16, 2019
Chemical control features in wafer process equipment
APPLIED MATERIALS INC40 citations97
US6890850B2May 10, 2005
Method of depositing dielectric materials in damascene applications
APPLIED MATERIALS INC92 citations97
US6387207B1May 14, 2002
Integration of remote plasma generator with semiconductor processing chamber
APPLIED MATERIALS INC944 citations97
US6374831B1Apr 23, 2002
Accelerated plasma clean
APPLIED MATERIALS INC642 citations97
US7087497B2Aug 8, 2006
Low-thermal-budget gapfill process
APPLIED MATERIALS INC54 citations96
US6591850B2Jul 15, 2003
Method and apparatus for fluid flow control
APPLIED MATERIALS INC68 citations96
US6913992B2Jul 5, 2005
Method of modifying interlayer adhesion
APPLIED MATERIALS INC34 citations95
US10256079B2Apr 9, 2019
Semiconductor processing systems having multiple plasma configurations
APPLIED MATERIALS INC42 citations94
US7935643B2May 3, 2011
Stress management for tensile films
APPLIED MATERIALS INC48 citations94
US6495233B1Dec 17, 2002
Apparatus for distributing gases in a chemical vapor deposition system
APPLIED MATERIALS INC77 citations93
US7226876B2Jun 5, 2007
Method of modifying interlayer adhesion
APPLIED MATERIALS INC14 citations92
US7200460B2Apr 3, 2007
Method of depositing low dielectric constant silicon carbide layers
APPLIED MATERIALS INC17 citations92
US7033945B2Apr 25, 2006
Gap filling with a composite layer
APPLIED MATERIALS INC43 citations92
CISCO TECH INC
2 patentsSAPRE KEDAR
1 patentLIANG JINGMEI
1 patentTANG JING
1 patentBHATIA SIDHARTH
1 patentCHUC KIEN N
1 patentMANDREKAR TUSHAR V
1 patentWANG LINLIN
1 patentShowing the top 50 of 109 patents by PatentIndex Score.