Inventor

TAKAMICHI HIROSHI

JP3 patents

⚠️ This page may combine multiple inventors who share the name “TAKAMICHI HIROSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SUMITOMO METAL IND

1 patent

US6199273B1Mar 13, 2001

Method of forming connector structure for a ball-grid array

SUMITOMO METAL IND57 citations91

SUMITOMO METAL SMI ELECTRONICS

1 patent

US6054755AApr 25, 2000

Semiconductor package with improved moisture vapor relief function and method of fabricating the same

SUMITOMO METAL SMI ELECTRONICS88 citations91

TOSHIBA KK

1 patent

US5463248AOct 31, 1995

Semiconductor package using an aluminum nitride substrate

TOSHIBA KK15 citations69