Inventor · disambiguated record

Eul-Bin Im

Also filed as: IM EUL-BIN

2 granted patents·242 citations·filing 2001–2001

71Inventor score

Technology areasH10W

Files withFAIRCHILD KR SEMICONDUCTOR LTD2

Top patents by PatentIndex Score

2 records

0192US6432750B2Power module package having insulator type heat sink attached to rear surface of lead frame and manufacturing method thereofFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2001·Granted Aug 13, 2002·143 cites·18 claims
0291US6574107B2Stacked intelligent power module packageFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2001·Granted Jun 3, 2003·99 cites·18 claims

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