Inventor

KIM BYEONG GON

KR2 patents

Patents

2 patents

US6574107B2Jun 3, 2003

Stacked intelligent power module package

FAIRCHILD KR SEMICONDUCTOR LTD99 citations95

US6432750B2Aug 13, 2002

Power module package having insulator type heat sink attached to rear surface of lead frame and manufacturing method thereof

FAIRCHILD KR SEMICONDUCTOR LTD143 citations94