Inventor
ASAMI HIROSHI
JP45 patents
⚠️ This page may combine multiple inventors who share the name “ASAMI HIROSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SONY CORP
14 patentsUS7728431B2Jun 1, 2010
Electronic component, semiconductor device employing same, and method for manufacturing electronic component
SONY CORP39 citations92
US9379155B2Jun 28, 2016
Semiconductor device and method of manufacturing the same
SONY CORP5 citations83
US7421777B2Sep 9, 2008
Method of manufacturing multilayer wiring substrate using temporary metal support layer
SONY CORP12 citations79
US6831357B2Dec 14, 2004
Circuit substrate device, method for producing the same, semiconductor device and method for producing the same
SONY CORP11 citations74
US9041179B2May 26, 2015
Semiconductor device and method of manufacturing the same
SONY CORP3 citations73
US11315970B2Apr 26, 2022
Semiconductor device and method of manufacturing the same
SONY CORP2 citations72
US10050074B2Aug 14, 2018
Semiconductor device and method of manufacturing the same
SONY CORP3 citations72
US7420127B2Sep 2, 2008
Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate
SONY CORP6 citations72
US7053315B2May 30, 2006
Junction structure and junction method for conductive projection
SONY CORP8 citations68
US7138294B2Nov 21, 2006
Circuit substrate device, method for producing the same, semiconductor device and method for producing the same
SONY CORP3 citations63
US7691672B2Apr 6, 2010
Substrate treating method and method of manufacturing semiconductor apparatus
SONY CORP4 citations61
US9918388B2Mar 13, 2018
Circuit substrate, method of manufacturing circuit substrate, and electronic component
SONY CORP0 citations52
US7939360B2May 10, 2011
Semiconductor device and manufacturing method therefor
SONY CORP0 citations52
US7288724B2Oct 30, 2007
Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate
SONY CORP0 citations51
HOYA CORP
5 patentsUS6156242ADec 5, 2000
Method of injection molding plastic lens
HOYA CORP62 citations96
USRE38617EOct 12, 2004
Method of injection molding plastic lens
HOYA CORP20 citations92
US6210610B1Apr 3, 2001
Method of manufacturing lens, injection mold for molding of lens, and molded lens
HOYA CORP29 citations92
US5972252AOct 26, 1999
Injection compression molding method of a spectacle lens and a spectacle lens produced by using the same
HOYA CORP28 citations92
US5948327ASep 7, 1999
Lens injection-compression-molding method
HOYA CORP21 citations92
HOYA LENS THAILAND LTD
5 patentsUS12140821B2Nov 12, 2024
Progressive addition lens and design method therefor
HOYA LENS THAILAND LTD0 citations62
US12099260B2Sep 24, 2024
Progressive addition lens and design method therefor
HOYA LENS THAILAND LTD0 citations51
US10642070B2May 5, 2020
Progressive addition lens
HOYA LENS THAILAND LTD0 citations41
US10545354B2Jan 28, 2020
Designing method and designing device for progressive power lens
HOYA LENS THAILAND LTD0 citations41
US10401649B2Sep 3, 2019
Method of designing progressive refractive power lens, and lens set
HOYA LENS THAILAND LTD0 citations41
ASAMI HIROSHI
5 patentsUS11886047B2Jan 30, 2024
Spectacle lenses and methods for producing the same
ASAMI HIROSHI0 citations60
US11598977B2Mar 7, 2023
Spectacle lenses and methods for producing the same
ASAMI HIROSHI0 citations60
US8146243B2Apr 3, 2012
Method of manufacturing a device incorporated substrate and method of manufacturing a printed circuit board
ASAMI HIROSHI3 citations58
US8987899B2Mar 24, 2015
Circuit board, semiconductor element, semiconductor device, method for manufacturing circuit board, method for manufacturing semiconductor element, and method for manufacturing semiconductor device
ASAMI HIROSHI0 citations51
US8263871B2Sep 11, 2012
Mount board and semiconductor module
ASAMI HIROSHI1 citations51