Inventor
LIN YUNG-LUNG
TW42 patents
⚠️ This page may combine multiple inventors who share the name “LIN YUNG-LUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
28 patentsUS9704827B2Jul 11, 2017
Hybrid bond pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD32 citations98
US10050018B2Aug 14, 2018
3DIC structure and methods of forming
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations92
US11127635B1Sep 21, 2021
Techniques for wafer stack processing
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations85
US10727205B2Jul 28, 2020
Hybrid bonding technology for stacking integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10395974B1Aug 27, 2019
Method for forming a thin semiconductor-on-insulator (SOI) substrate
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84
US12315843B2May 27, 2025
Hybrid bonding technology for stacking integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations75
US11804473B2Oct 31, 2023
Hybrid bond pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11410972B2Aug 9, 2022
Hybrid bonding technology for stacking integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11322481B2May 3, 2022
Hybrid bonding technology for stacking integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10727218B2Jul 28, 2020
Seal ring structures and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US10269770B2Apr 23, 2019
Hybrid bond pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11087971B2Aug 10, 2021
Method for manufacturing semiconductor device and manufacturing method of the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10522514B2Dec 31, 2019
3DIC structure and methods of forming
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10504716B2Dec 10, 2019
Method for manufacturing semiconductor device and manufacturing method of the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12300670B2May 13, 2025
Hybrid bond pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12293946B2May 6, 2025
Techniques for wafer stack processing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12237165B2Feb 25, 2025
Method for wafer bonding including edge trimming
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11984431B2May 14, 2024
3DIC structure and methods of forming
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11842992B2Dec 12, 2023
Seal ring structures and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11587908B2Feb 21, 2023
3DIC structure and methods of forming
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11545395B2Jan 3, 2023
Techniques for wafer stack processing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11342322B2May 24, 2022
Seal ring structures and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11024602B2Jun 1, 2021
Hybrid bond pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10453832B2Oct 22, 2019
Seal ring structures and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11951569B2Apr 9, 2024
Damage prevention during wafer edge trimming
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9704820B1Jul 11, 2017
Semiconductor manufacturing method and associated semiconductor manufacturing system
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12519020B2Jan 6, 2026
Semiconductor processing tool and methods of operation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12360314B2Jul 15, 2025
Photonic semiconductor-on-insulator (SOI) substrate and method for forming the photonic SOI substrate
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
TAIWAN SEMICONDUCTOR MFG
8 patentsUS7701755B2Apr 20, 2010
Memory having improved power design
TAIWAN SEMICONDUCTOR MFG41 citations92
US7688613B2Mar 30, 2010
Method and system for controlling multiple electrical fuses with one program device
TAIWAN SEMICONDUCTOR MFG13 citations84
US7505319B2Mar 17, 2009
Method and apparatus for high efficiency redundancy scheme for multi-segment SRAM
TAIWAN SEMICONDUCTOR MFG13 citations84
US7319355B2Jan 15, 2008
Pulse generator
TAIWAN SEMICONDUCTOR MFG14 citations84
US7271644B2Sep 18, 2007
Multi-state electrical fuse
TAIWAN SEMICONDUCTOR MFG14 citations84
US7468903B2Dec 23, 2008
Circuits for improving read and write margins in multi-port SRAMS
TAIWAN SEMICONDUCTOR MFG18 citations83
US7577052B2Aug 18, 2009
Power switching circuit
TAIWAN SEMICONDUCTOR MFG6 citations61
US7535788B2May 19, 2009
Dynamic power control for expanding SRAM write margin
TAIWAN SEMICONDUCTOR MFG3 citations61