P

Inventor

LIN YUNG-LUNG

TW42 patents
⚠️ This page may combine multiple inventors who share the name “LIN YUNG-LUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

28 patents
US9704827B2Jul 11, 2017

Hybrid bond pad structure

TAIWAN SEMICONDUCTOR MFG CO LTD32 citations98
US10050018B2Aug 14, 2018

3DIC structure and methods of forming

TAIWAN SEMICONDUCTOR MFG CO LTD12 citations92
US11127635B1Sep 21, 2021

Techniques for wafer stack processing

TAIWAN SEMICONDUCTOR MFG CO LTD12 citations85
US10727205B2Jul 28, 2020

Hybrid bonding technology for stacking integrated circuits

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10395974B1Aug 27, 2019

Method for forming a thin semiconductor-on-insulator (SOI) substrate

TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84
US12315843B2May 27, 2025

Hybrid bonding technology for stacking integrated circuits

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations75
US11804473B2Oct 31, 2023

Hybrid bond pad structure

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11410972B2Aug 9, 2022

Hybrid bonding technology for stacking integrated circuits

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11322481B2May 3, 2022

Hybrid bonding technology for stacking integrated circuits

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10727218B2Jul 28, 2020

Seal ring structures and methods of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US10269770B2Apr 23, 2019

Hybrid bond pad structure

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11087971B2Aug 10, 2021

Method for manufacturing semiconductor device and manufacturing method of the same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10522514B2Dec 31, 2019

3DIC structure and methods of forming

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10504716B2Dec 10, 2019

Method for manufacturing semiconductor device and manufacturing method of the same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12300670B2May 13, 2025

Hybrid bond pad structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12293946B2May 6, 2025

Techniques for wafer stack processing

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12237165B2Feb 25, 2025

Method for wafer bonding including edge trimming

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11984431B2May 14, 2024

3DIC structure and methods of forming

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11842992B2Dec 12, 2023

Seal ring structures and methods of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11587908B2Feb 21, 2023

3DIC structure and methods of forming

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11545395B2Jan 3, 2023

Techniques for wafer stack processing

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11342322B2May 24, 2022

Seal ring structures and methods of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11024602B2Jun 1, 2021

Hybrid bond pad structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10453832B2Oct 22, 2019

Seal ring structures and methods of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11951569B2Apr 9, 2024

Damage prevention during wafer edge trimming

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9704820B1Jul 11, 2017

Semiconductor manufacturing method and associated semiconductor manufacturing system

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12519020B2Jan 6, 2026

Semiconductor processing tool and methods of operation

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12360314B2Jul 15, 2025

Photonic semiconductor-on-insulator (SOI) substrate and method for forming the photonic SOI substrate

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51

TAIWAN SEMICONDUCTOR MFG

8 patents

LIN YUNG-LUNG

2 patents

WANG WEI-YA

2 patents

IND TECH RES INST

1 patent

TSAO SHENG-HSIUNG

1 patent