Inventor

HUANG CHIH-HUI

TW48 patents

⚠️ This page may combine multiple inventors who share the name “HUANG CHIH-HUI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUANG CHIH-HUI

TAIWAN SEMICONDUCTOR MFG CO LTD

Conductive pad structure for hybrid bonding and methods of forming same

Hybrid bond using a copper alloy for yield improvement

Hybrid bonding mechanisms for semiconductor wafers

Bond chuck, methods of bonding, and tool including bond chuck

Mechanisms for cleaning substrate surface for hybrid bonding

Multi-wafer capping layer for metal arcing protection

Bonding support structure (and related process) for wafer stacking

Selective deposition and planarization for a CMOS image sensor

Wafer processing method and apparatus

Bond chuck, methods of bonding, and tool including bond chuck

Deep trench isolation fabrication for BSI image sensor

Semiconductor structure and method of manufacturing the same

Method of forming deep trench isolation in radiation sensing substrate and image sensor device

Film formation apparatus for forming semiconductor structure having shower head with plural hole patterns and with corresponding different plural hole densities

Semiconductor device having stress-neutralized film stack and method of fabricating same

Interconnect structure for stacked device

Conductive pad structure for hybrid bonding and methods of forming same

Method for manufacturing semiconductor device and manufacturing method of the same

Mechanisms for cleaning substrate surface for hybrid bonding

Method for manufacturing semiconductor device and manufacturing method of the same

Composite bond structure in stacked semiconductor structure

Multi-wafer capping layer for metal arcing protection

Multi-wafer capping layer for metal arcing protection

Bonding support structure (and related process) for wafer stacking

Gas shower head with plural hole patterns and with corresponding different plural hole densities and film formation method

Method of forming deep trench isolation in radiation sensing substrate and image sensor device

Method for wafer bonding including edge trimming

Method of forming semiconductor device

Interconnect structure for stacked device

Method of forming deep trench isolation in radiation sensing substrate and image sensor device

Method of forming semiconductor device

Wafer bonding method and apparatus with curved surfaces

Manufacturing methods of semiconductor image sensor devices

Interconnect structure for stacked device

Reflector for backside illuminated (BSI) image sensor

Wafer processing method and apparatus

Conductive pad structure for hybrid bonding and methods of forming same

Deep trench isolation fabrication for BSI image sensor

Method of forming deep trench isolation in radiation sensing substrate and image sensor device

Semiconductor devices, image sensors, and methods of manufacture thereof

TAIWAN SEMICONDUCTOR MFG

Hybrid bonding mechanisms for semiconductor wafers

Hybrid bonding and apparatus for performing the same

Image sensor trench isolation with conformal doping

Semiconductor device with compressive layers

Antireflective layer for backside illuminated image sensor and method of manufacturing same

LAI CHIH-YU

Image sensor trench isolation with conformal doping

TSAO CHUN-HAN

Image sensor having compressive layers

SILICONWARE PRECISION INDUSTRIES CO LTD

Ultrasonic device