Inventor

TZENG KUO-HWA

TW23 patents

⚠️ This page may combine multiple inventors who share the name “TZENG KUO-HWA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TZENG KUO-HWA

TAIWAN SEMICONDUCTOR MFG CO LTD

SOI substrate, semiconductor device and method for manufacturing the same

High dielectric constant structure for the vertical transfer gates of a complementary metal-oxide semiconductor (CMOS) image sensor

Method for forming thin semiconductor-on-insulator (SOI) substrates

Method for forming thin semiconductor-on-insulator (SOI) substrates

Method for manufacturing semiconductor device and manufacturing method of the same

Method for manufacturing semiconductor device and manufacturing method of the same

Method for forming thin semiconductor-on-insulator (SOI) substrates

Method for wafer bonding including edge trimming

Back-side deep trench isolation structure for image sensor

Back-side deep trench isolation structure for image sensor

SOI substrate, semiconductor device and method for manufacturing the same

Method for forming trench liner passivation

Trench liner passivation for dark current improvement

Semiconductor device structure having carrier-trapping layers with different grain sizes

CHEN NENG-KUO

Hybrid STI gap-filling approach

Method for forming interconnect structures

Hybrid gap-fill approach for STI formation

Selective etch-back process for semiconductor devices

Hybrid gap-fill approach for STI formation

Method of forming shallow trench isolation structure

TAIWAN SEMICONDUCTOR MFG

STI film property using SOD post-treatment

Shallow trench isolation corner rounding

ADVANCED SEMICONDUCTOR ENG

Electronic device package and method of manufacturing the same