P

Inventor

CHOU CHENG-HSIEN

TW139 patents
⚠️ This page may combine multiple inventors who share the name “CHOU CHENG-HSIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

31 patents
US9437572B2Sep 6, 2016

Conductive pad structure for hybrid bonding and methods of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD227 citations99
US9704904B2Jul 11, 2017

Deep trench isolation structures and methods of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD22 citations94
US10043841B1Aug 7, 2018

Image sensor device and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD20 citations93
US10050018B2Aug 14, 2018

3DIC structure and methods of forming

TAIWAN SEMICONDUCTOR MFG CO LTD12 citations92
US11610812B2Mar 21, 2023

Multi-wafer capping layer for metal arcing protection

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations86
US11152276B2Oct 19, 2021

Trim wall protection method for multi-wafer stacking

TAIWAN SEMICONDUCTOR MFG CO LTD17 citations86
US10734285B2Aug 4, 2020

Bonding support structure (and related process) for wafer stacking

TAIWAN SEMICONDUCTOR MFG CO LTD11 citations86
US11664411B2May 30, 2023

Semiconductor structure having integrated inductor therein

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations85
US11127635B1Sep 21, 2021

Techniques for wafer stack processing

TAIWAN SEMICONDUCTOR MFG CO LTD12 citations85
US11011600B2May 18, 2021

Semiconductor structure having integrated inductor therein

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10541297B2Jan 21, 2020

Semiconductor structure having integrated inductor therein

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10319768B2Jun 11, 2019

Image sensor scheme for optical and electrical improvement

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10164001B1Dec 25, 2018

Semiconductor structure having integrated inductor therein

TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84
US9960200B1May 1, 2018

Selective deposition and planarization for a CMOS image sensor

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9754993B2Sep 5, 2017

Deep trench isolations and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9653507B2May 16, 2017

Deep trench isolation shrinkage method for enhanced device performance

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9281331B2Mar 8, 2016

High dielectric constant structure for the vertical transfer gates of a complementary metal-oxide semiconductor (CMOS) image sensor

TAIWAN SEMICONDUCTOR MFG CO LTD16 citations84
US11715674B2Aug 1, 2023

Trim wall protection method for multi-wafer stacking

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations75
US11735617B2Aug 22, 2023

Semiconductor structure, back-side illuminated image sensor and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11705470B2Jul 18, 2023

Image sensor scheme for optical and electrical improvement

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11600647B2Mar 7, 2023

Absorption enhancement structure to increase quantum efficiency of image sensor

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10998364B2May 4, 2021

Image sensor scheme for optical and electrical improvement

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10526703B2Jan 7, 2020

Film formation apparatus for forming semiconductor structure having shower head with plural hole patterns and with corresponding different plural hole densities

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10325956B2Jun 18, 2019

Deep trench isolation shrinkage method for enhanced device performance

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10283550B2May 7, 2019

Semiconductor structure, back-side illuminated image sensor and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10163947B2Dec 25, 2018

Photodiode gate dielectric protection layer

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10008531B2Jun 26, 2018

Varied STI liners for isolation structures in image sensing devices

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9991303B2Jun 5, 2018

Image sensor device structure

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9842816B2Dec 12, 2017

Conductive pad structure for hybrid bonding and methods of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9812477B2Nov 7, 2017

Photodiode gate dielectric protection layer

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9627326B2Apr 18, 2017

Method for forming alignment marks and structure of same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

CHOU WEN SAN

9 patents

UNITED MICROELECTRONICS CORP

3 patents

YU CHIH-HAO

3 patents

UNITECH PRINTED CIRCUIT BOARD

2 patents

TAIWAN SEMICONDUCTOR MFG

1 patent

UNIK WORLD IND CO LTD

1 patent

Showing the top 50 of 139 patents by PatentIndex Score.