P

Inventor

SON YOUNG-HOON

KR22 patents
⚠️ This page may combine multiple inventors who share the name “SON YOUNG-HOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

20 patents
US10566038B2Feb 18, 2020

Method of controlling on-die termination and system performing the same

SAMSUNG ELECTRONICS CO LTD8 citations84
US10416896B2Sep 17, 2019

Memory module, memory device, and processing device having a processor mode, and memory system

SAMSUNG ELECTRONICS CO LTD11 citations83
US10916279B2Feb 9, 2021

Method of controlling on-die termination and system performing the same

SAMSUNG ELECTRONICS CO LTD3 citations73
US10692554B2Jun 23, 2020

Method of controlling on-die termination and system performing the same

SAMSUNG ELECTRONICS CO LTD2 citations73
US10566968B1Feb 18, 2020

Output driver, and semiconductor memory device and memory system having the same

SAMSUNG ELECTRONICS CO LTD2 citations73
US11508420B2Nov 22, 2022

Memory device, memory system, and operation method of memory device

SAMSUNG ELECTRONICS CO LTD1 citations71
US11062744B2Jul 13, 2021

Memory device performing ZQ calibration, memory system, and operation method of memory device

SAMSUNG ELECTRONICS CO LTD2 citations71
US11687114B2Jun 27, 2023

Clock converting circuit with symmetric structure

SAMSUNG ELECTRONICS CO LTD0 citations62
US11475930B2Oct 18, 2022

Method of controlling on-die termination and system performing the same

SAMSUNG ELECTRONICS CO LTD0 citations62
US11461176B2Oct 4, 2022

Memory device and memory system

SAMSUNG ELECTRONICS CO LTD1 citations62
US11169711B2Nov 9, 2021

Memory module, memory device, and processing device having a processor mode, and memory system

SAMSUNG ELECTRONICS CO LTD1 citations62
US10763242B2Sep 1, 2020

Semiconductor package and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD1 citations62
US10665558B2May 26, 2020

Semiconductor memory including pads arranged in parallel

SAMSUNG ELECTRONICS CO LTD1 citations62
US12211581B2Jan 28, 2025

Memory device, memory system, and operation method of memory device

SAMSUNG ELECTRONICS CO LTD0 citations60
US11244926B2Feb 8, 2022

Semiconductor package and manufacturing method thereof

SAMSUNG ELECTRONICS CO LTD0 citations52
US12219774B2Feb 4, 2025

Nonvolatile memory chip and semiconductor package including the same

SAMSUNG ELECTRONICS CO LTD0 citations51
US10134487B2Nov 20, 2018

Semiconductor memory device and memory system including the same

SAMSUNG ELECTRONICS CO LTD1 citations51
US9767887B2Sep 19, 2017

Memory device, memory module including the same, and memory system including the same

SAMSUNG ELECTRONICS CO LTD1 citations51
US9226905B2Jan 5, 2016

Pharmaceutical composition for preventing or treating muscle wasting-related disease comprising diaminodiphenylsulfone or pharmaceutically acceptable salt thereof

SAMSUNG ELECTRONICS CO LTD0 citations47
US10424497B2Sep 24, 2019

Wafer carrier

SAMSUNG ELECTRONICS CO LTD0 citations42

HEWLETT PACKARD DEVELOPMENT CO

1 patent

CORNING PREC MATERIALS CO LTD

1 patent