Inventor
RAY SUDIPTA KUMAR
US10 patents
⚠️ This page may combine multiple inventors who share the name “RAY SUDIPTA KUMAR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
8 patentsUS6184062B1Feb 6, 2001
Process for forming cone shaped solder for chip interconnection
IBM56 citations94
US5796169AAug 18, 1998
Structurally reinforced ball grid array semiconductor package and systems
IBM112 citations94
US6559527B2May 6, 2003
Process for forming cone shaped solder for chip interconnection
IBM28 citations90
US6395991B1May 28, 2002
Column grid array substrate attachment with heat sink stress relief
IBM54 citations90
US6053394AApr 25, 2000
Column grid array substrate attachment with heat sink stress relief
IBM39 citations90
US6259155B1Jul 10, 2001
Polymer enhanced column grid array
IBM31 citations89
US6015955AJan 18, 2000
Reworkability solution for wirebound chips using high performance capacitor
IBM13 citations72
US6226863B1May 8, 2001
Reworkability method for wirebond chips using high performance capacitor
IBM4 citations61