Inventor
MCDEVITT THOMAS LEDDY
US9 patents
⚠️ This page may combine multiple inventors who share the name “MCDEVITT THOMAS LEDDY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
5 patentsUS6187680B1Feb 13, 2001
Method/structure for creating aluminum wirebound pad on copper BEOL
IBM353 citations96
US7538006B1May 26, 2009
Annular damascene vertical natural capacitor
IBM18 citations90
US6333559B1Dec 25, 2001
Method/structure for creating aluminum wirebound pad on copper BEOL
IBM41 citations90
US8026606B2Sep 27, 2011
Interconnect layers without electromigration
IBM4 citations62
US7585758B2Sep 8, 2009
Interconnect layers without electromigration
IBM4 citations62
ANDERSON FELIX PATRICK
3 patentsUS8530970B2Sep 10, 2013
Curvilinear wiring structure to reduce areas of high field density in an integrated circuit
ANDERSON FELIX PATRICK1 citations59
US8137791B2Mar 20, 2012
Fuse and pad stress relief
ANDERSON FELIX PATRICK4 citations59
US8129844B2Mar 6, 2012
Method of forming a metal silicide layer, devices incorporating metal silicide layers and design structures for the devices
ANDERSON FELIX PATRICK0 citations48