Inventor
KOURAKATA SHINOBU
JP5 patents
Patents
5 patentsUS7033911B2Apr 25, 2006
Adhesive of folded package
INTEL CORP29 citations87
US9460982B2Oct 4, 2016
Integrated heat spreader for multi-chip packages
INTEL CORP6 citations81
US9236323B2Jan 12, 2016
Integrated heat spreader for multi-chip packages
INTEL CORP6 citations81
US7335973B2Feb 26, 2008
Adhesive of folder package
INTEL CORP2 citations57
US7224075B2May 29, 2007
Methods and systems for attaching die in stacked-die packages
INTEL CORP6 citations56