Inventor
Wang jia wen
CN10 patents
Patents
10 patentsUS10580788B2Mar 3, 2020
Methods for forming three-dimensional memory devices
YANGTZE MEMORY TECH CO LTD14 citations85
US11289422B2Mar 29, 2022
Bonding alignment marks at bonding in interface
YANGTZE MEMORY TECH CO LTD6 citations84
US10748851B1Aug 18, 2020
Hybrid bonding using dummy bonding contacts and dummy interconnects
YANGTZE MEMORY TECH CO LTD6 citations83
US11462503B2Oct 4, 2022
Hybrid bonding using dummy bonding contacts
YANGTZE MEMORY TECH CO LTD2 citations72
US11205619B2Dec 21, 2021
Hybrid bonding using dummy bonding contacts and dummy interconnects
YANGTZE MEMORY TECH CO LTD2 citations72
US11049834B2Jun 29, 2021
Hybrid bonding using dummy bonding contacts
YANGTZE MEMORY TECH CO LTD3 citations72
US10679854B2Jun 9, 2020
Wafer bonding method and structure thereof
YANGTZE MEMORY TECH CO LTD2 citations65
US12588495B2Mar 24, 2026
Bonding alignment marks at bonding interface
YANGTZE MEMORY TECH CO LTD0 citations61
US11876049B2Jan 16, 2024
Bonding alignment marks at bonding interface
YANGTZE MEMORY TECH CO LTD0 citations61
US11342185B2May 24, 2022
Wafer bonding method and structure thereof
YANGTZE MEMORY TECH CO LTD0 citations55