Inventor
HUANG SHI QI
CN9 patents
Patents
9 patentsUS10748851B1Aug 18, 2020
Hybrid bonding using dummy bonding contacts and dummy interconnects
YANGTZE MEMORY TECH CO LTD6 citations83
US11462503B2Oct 4, 2022
Hybrid bonding using dummy bonding contacts
YANGTZE MEMORY TECH CO LTD2 citations72
US11348936B2May 31, 2022
Three-dimensional memory devices and fabricating methods thereof
YANGTZE MEMORY TECH CO LTD2 citations72
US11205619B2Dec 21, 2021
Hybrid bonding using dummy bonding contacts and dummy interconnects
YANGTZE MEMORY TECH CO LTD2 citations72
US11094714B2Aug 17, 2021
Three-dimensional memory devices and fabricating methods thereof
YANGTZE MEMORY TECH CO LTD3 citations72
US11049834B2Jun 29, 2021
Hybrid bonding using dummy bonding contacts
YANGTZE MEMORY TECH CO LTD3 citations72
US12402309B2Aug 26, 2025
Three-dimensional memory devices and fabricating methods thereof
YANGTZE MEMORY TECH CO LTD0 citations62
US11342352B2May 24, 2022
Three-dimensional memory devices and fabricating methods thereof
YANGTZE MEMORY TECH CO LTD0 citations62
US11270770B2Mar 8, 2022
Local word line driver device, memory device, and fabrication method thereof
YANGTZE MEMORY TECH CO LTD0 citations59