Inventor

ZHU JIFENG

CN45 patents

⚠️ This page may combine multiple inventors who share the name “ZHU JIFENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ZHU JIFENG

YANGTZE MEMORY TECH CO LTD

Three-dimensional memory devices having a plurality of NAND strings

Memory cell structure of a three-dimensional memory device

Methods for forming three-dimensional memory devices

Three-dimensional memory devices and methods for forming the same

Three-dimensional memory devices having a plurality of NAND strings

Three-dimensional memory devices

Method for forming lead wires in hybrid-bonded semiconductor devices

Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof

Hybrid bonding using dummy bonding contacts and dummy interconnects

Staircase structure for memory device

Word line contact structure for three-dimensional memory devices and fabrication methods thereof

Method for forming lead wires in hybrid-bonded semiconductor devices

Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof

Bonded semiconductor structures having bonding contacts made of indiffusible conductive materials and methods for forming the same

Three-dimensional memory devices and fabricating methods thereof

Hybrid bonding using dummy bonding contacts

Hybrid bonding using dummy bonding contacts and dummy interconnects

Staircase structure for memory device

Hybrid bonding using dummy bonding contacts

Memory cell structure of a three-dimensional memory device

Memory structure and method for forming the same

Memory cell structure of a three-dimensional memory device

Method for forming dual-deck channel hole structure of three-dimensional memory device

Memory structure and forming method thereof

Staircase structure for memory device

Memory cell structure of a three-dimensional memory device

Staircase structure for memory device

Method for forming lead wires in hybrid-bonded semiconductor devices

Three-dimensional memory devices and methods for forming the same

Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof

Three-dimensional memory devices having a plurality of NAND strings located between a substrate and a single crystalline silicon layer

Method for forming lead wires in hybrid-bonded semiconductor devices

Three-dimensional memory devices having a plurality of NAND strings

Bonded semiconductor structures having bonding contacts made of indiffusible conductive materials and methods for forming the same

Word line contact structure for three-dimensional memory devices and fabrication methods thereof

Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof

Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof

Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof

Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof

Three-dimensional memory devices and fabricating methods thereof

Three-dimensional memory devices and fabricating methods thereof

WUHAN XINXIN SEMICONDUCTOR MFG

Preparation process of image sensors

Semiconductor cooling method and method of heat dissipation

Preparation method of three-dimensional integrated inductor-capacitor structure

HUAWEI TECH CO LTD

Chip stacking structure and preparation method thereof, chip stacking package, and electronic device