Inventor

TSUTSUMI YOSHIHIRO

JP26 patents

⚠️ This page may combine multiple inventors who share the name “TSUTSUMI YOSHIHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TSUTSUMI YOSHIHIRO

SHINETSU CHEMICAL CO

Thermosetting silicone resin composition for reflector of LED, reflector for LED using the same and optical semiconductor apparatus

Heat-curable resin composition for semiconductor encapsulation and semiconductor device

Method for producing cured product of heat-curable maleimide resin composition

Heat-curable citraconimide resin composition

Heat-curable resin composition and uses thereof

Heat-curable maleimide resin composition

Thermosetting silicone resin composition for reflector of LED, reflector for LED using the same and optical semiconductor apparatus

Bismaleimide compound and production method thereof

Heat-curable resin composition, heat-curable resin film and semiconductor device

Composite particle, method of producing same, resin composition containing the particle, reflector formed from the composition, and light-emitting semiconductor device using the reflector

Heat-curable maleimide resin composition for RTM, fiber-reinforced composite material and radome

Heat-curable resin composition and semiconductor device

Heat-curable resin composition for semiconductor encapsulation and semiconductor device

Slurry composition, cured product of the slurry composition, and substrate, film and prepreg using the cured product

Adhesive composition for flexible printed-wiring board (FPC), and heat-curable resin film, prepreg and FPC substrate containing same

Low-dielectric heat dissipation film composition and low-dielectric heat dissipation film

Thermosetting epoxy resin sheet for encapsulating semiconductor, semiconductor equipment, and method for manufacturing the same

Fiber-containing resin substrate, encapsulated semiconductor devices mounting substrate, encapsulated semiconductor devices forming wafer, encapsulated semiconductor devices mounting sheet, semiconductor equipment, and method for manufacturing semiconductor equipment

White heat-curable epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using same

Heat-curable epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using same

White heat-curable epoxy resin composition, optical semiconductor element case made of the white heat-curable epoxy resin composition and optical semiconductor device comprised of the case

Heat-curable epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using same

White thermosetting silicone resin composition for a light-emitting semiconductor device and a case for installing a light-emitting semiconductor element

DISCO CORP

Wafer processing method

DAIKIN IND LTD

Fin assembling method

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Platen knob