Inventor
NAKAI TAKAMASA
JP4 patents
Patents
4 patentsUS5368921ANov 29, 1994
Metal foil-clad laminate having surface smoothness
MITSUBISHI GAS CHEMICAL CO43 citations91
US5435877AJul 25, 1995
Process for the production of copper-clad laminate
MITSUBISHI GAS CHEMICAL CO13 citations73
US5160787ANov 3, 1992
Electrical laminate having ability to absorb ultraviolet rays
MITSUBISHI GAS CHEMICAL CO16 citations72
US5242540ASep 7, 1993
Process for producing thin copper foil-clad circuit board substrate
MITSUBISHI GAS CHEMICAL CO17 citations71