Inventor

HSU CHI-HSING

TW56 patents

⚠️ This page may combine multiple inventors who share the name “HSU CHI-HSING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HSU CHI-HSING

VIA TECH INC

Chip package with embedded panel-shaped component

Quad flat no-lead chip carrier

Flip-chip die and flip-chip package substrate

Flip chip package carrier

Chip package and electrical connection structure between chip and substrate

Method of making wafer level packaging and chip structure

Chip package structure with glass substrate

Electronic device with flexible heat spreader

Package and package module of the package

Multi-conducting through hole structure

Multi-chip structure

Chip package with embedded component

Circuit structure of package substrate

Flip chip package and process of forming the same

Flip-chip package substrate

Signal transmission structure and circuit substrate thereof

Flip-chip package substrate

Flip-chip die for joining with a flip-chip substrate

Signal transmission structure and circuit substrate thereof

Chip package and stacked structure of chip packages

Circuit substrate and method of manufacturing plated through slot thereon

Bumpless chip package

Surrounding structure for a probe card

Semiconductor packaging substrate and method of producing the same

Flip-chip package substrate

Circuit carrier and package structure thereof

Semiconductor packaging substrate and method of producing the same

Chip structure with arrangement of side pads

TAIWAN SEMICONDUCTOR MFG CO LTD

Method of forming high performance MOSFETs having varying channel structures

High performance MOSFETs having varying channel structures

High performance MOSFETs having different device characteristics

Negative capacitance transistor having a multilayer ferroelectric structure or a ferroelectric layer with a gradient doping profile

Negative capacitance transistor with external ferroelectric structure

Negative capacitance transistor with a diffusion blocking layer

Negative capacitance transistor with a diffusion blocking layer

Negative capacitance transistor with external ferroelectric structure

Negative capacitance transistor having a multilayer ferroelectric structure or a ferroelectric layer with a gradient doping profile

Negative capacitance transistor with a diffusion blocking layer

Negative capacitance finFET and method of fabricating thereof

HSU CHI-HSING

Vertical stacked light emitting structure

Portable electronic device and image capturing module thereof

Flexible thin image-sensing module with anti-EMI function and flexible thin PCB module with anti-EMI function

Image-capturing module for simplifying optical component

Image-capturing module for simplifying optical component

AZUREWAVE TECHNOLOGIES INC

Image-sensing module for reducing overall thickness thereof and preventing EMI

Image sensing module and method of manufacturing the same

Image-capturing module for simplifying optical component and reducing assembly time

LED package structure for increasing light-emitting efficiency

VIA TECHNOLGIES INC

Multi-chip package with embedded cooling element

FICTA TECHNOLOGY INC

Method for improving the liquid dispensing of IC packages