Inventor

KIM TAE-YEONG

KR21 patents

⚠️ This page may combine multiple inventors who share the name “KIM TAE-YEONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KIM TAE-YEONG

SAMSUNG ELECTRONICS CO LTD

Wafer-to-wafer bonding structure

Method of fabricating multi-substrate semiconductor devices

Semiconductor devices

Method of manufacturing substrate structure

Multi-stacked device having TSV structure

Wafer processing methods

Semiconductor device including through via structures and redistribution structures

Method of bonding substrates utilizing a substrate holder with holding fingers

Apparatus for bonding substrates having a substrate holder with holding fingers and method of bonding substrates

Wafer bonding apparatus and wafer bonding system including the same

Method of manufacturing a semiconductor device

Wafer bonding apparatus for directly bonding wafers and a wafer bonding system having the same

Apparatuses of bonding substrates and methods of bonding substrates

Wafer bonding apparatus and wafer bonding system using the same

Semiconductor laser device

Substrate bonding apparatus

Wafer bonding apparatuses

Apparatus and method for selecting beam pattern in communication system supporting beamforming scheme

RESEARCH & BUSINESS FOUND SUNGKYUNKWAN UNIV

Sparse-coded ambient backscatter communication method and system

LG ELECTRONICS INC

Method for receiving signal using distribution storage cache retention auxiliary node in wireless communication system, and apparatus therefor

NEUROPHET INC

Electric stimulation simulation method, server, and computer program for determining optimal stimulation position combination