Inventor
KIM HOE-CHUL
KR4 patents
Patents
4 patentsUS10906283B2Feb 2, 2021
Wafer bonding apparatus for directly bonding wafers and a wafer bonding system having the same
SAMSUNG ELECTRONICS CO LTD5 citations71
US10833047B2Nov 10, 2020
Apparatuses of bonding substrates and methods of bonding substrates
SAMSUNG ELECTRONICS CO LTD5 citations70
US11283235B2Mar 22, 2022
Semiconductor laser device
SAMSUNG ELECTRONICS CO LTD0 citations61
US11728200B2Aug 15, 2023
Wafer bonding apparatuses
SAMSUNG ELECTRONICS CO LTD0 citations50