Inventor
LEWANDOWSKI ERIC PETER
US12 patents
⚠️ This page may combine multiple inventors who share the name “LEWANDOWSKI ERIC PETER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
11 patentsUS10879202B1Dec 29, 2020
System and method for forming solder bumps
IBM6 citations83
US11165010B2Nov 2, 2021
Cold-welded flip chip interconnect structure
IBM2 citations72
US10833241B1Nov 10, 2020
Thermalization structure for cryogenic temperature devices
IBM4 citations72
US11895932B2Feb 6, 2024
Selective chemical frequency modification of Josephson junction resonators
IBM0 citations62
US11195799B2Dec 7, 2021
Hybrid readout package for quantum multichip bonding
IBM1 citations62
US11990437B2May 21, 2024
System and method for forming solder bumps
IBM0 citations61
US11043690B2Jun 22, 2021
Sandwich-parallel micro-battery
IBM0 citations60
US11749605B2Sep 5, 2023
Hybrid under-bump metallization component
IBM0 citations58
US10937735B2Mar 2, 2021
Hybrid under-bump metallization component
IBM0 citations58
US12107065B2Oct 1, 2024
Uniform chip gaps via injection-molded solder pillars
IBM0 citations51
US12506137B2Dec 23, 2025
High capacity compact lithium thin film battery
IBM0 citations50