P

Inventor

LEI CONG

CN5 patents
⚠️ This page may combine multiple inventors who share the name “LEI CONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

AVARY HOLDING SHENZHEN CO LTD

3 patents
US10448540B2Oct 15, 2019

Ultrathin heat dissipation structure

AVARY HOLDING SHENZHEN CO LTD8 citations82
US11380603B2Jul 5, 2022

Method for making a heat dissipation structure

AVARY HOLDING SHENZHEN CO LTD0 citations60
US10923411B2Feb 16, 2021

Method for manufacturing an ultrathin heat dissipation structure

AVARY HOLDING SHENZHEN CO LTD0 citations60

QING DING PREC ELECTRONICS (HUAIAN) CO LTD

1 patent
US10745595B2Aug 18, 2020

Resin composition, adhesive layer, and circuit board utilizing same

QING DING PREC ELECTRONICS (HUAIAN) CO LTD0 citations50

FUKUI PREC COMPONENT SHENZHEN

1 patent
US10658265B2May 19, 2020

Heat dissipation structure, method for making the same, and electronic device having the same

FUKUI PREC COMPONENT SHENZHEN0 citations50