Inventor
CLARK GARRETT E
US47 patents
⚠️ This page may combine multiple inventors who share the name “CLARK GARRETT E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD DEVELOPMENT CO
35 patentsUS11440008B2Sep 13, 2022
Microfluidic device with capillary chamber
HEWLETT PACKARD DEVELOPMENT CO3 citations73
US10369790B2Aug 6, 2019
Fluid dispenser
HEWLETT PACKARD DEVELOPMENT CO2 citations72
US11712896B2Aug 1, 2023
Nozzle arrangements and supply channels
HEWLETT PACKARD DEVELOPMENT CO2 citations71
US11305537B2Apr 19, 2022
Nozzle arrangements and supply channels
HEWLETT PACKARD DEVELOPMENT CO4 citations71
US11034151B2Jun 15, 2021
Nozzle arrangements
HEWLETT PACKARD DEVELOPMENT CO3 citations71
US6938988B2Sep 6, 2005
Counter-bore of a fluid ejection device
HEWLETT PACKARD DEVELOPMENT CO11 citations71
US9199461B2Dec 1, 2015
Print head die
HEWLETT PACKARD DEVELOPMENT CO2 citations63
US7568777B2Aug 4, 2009
Altering firing order
HEWLETT PACKARD DEVELOPMENT CO2 citations63
US12257837B2Mar 25, 2025
Interspersed fluidic elements and circuit elements in a fluidic die
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US11285731B2Mar 29, 2022
Fluid feed hole port dimensions
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US11235574B2Feb 1, 2022
Fluid propelling apparatus including a heat sink
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US10343397B2Jul 9, 2019
Printer cartridge with multiple fluid chambers in fluid communication
HEWLETT PACKARD DEVELOPMENT CO1 citations62
US11958293B2Apr 16, 2024
Nozzle arrangements
HEWLETT PACKARD DEVELOPMENT CO0 citations61
US11807005B2Nov 7, 2023
Nozzle arrangements
HEWLETT PACKARD DEVELOPMENT CO0 citations61
US11247470B2Feb 15, 2022
Nozzle arrangements and feed holes
HEWLETT PACKARD DEVELOPMENT CO0 citations61
US9937714B2Apr 10, 2018
Print head die with thermal control
HEWLETT PACKARD DEVELOPMENT CO1 citations61
US12233645B2Feb 25, 2025
Fluidic die having trickle-warming and pulse-warming circuits
HEWLETT PACKARD DEVELOPMENT CO0 citations60
US12128684B2Oct 29, 2024
Fluid channels of different types
HEWLETT PACKARD DEVELOPMENT CO0 citations58
US9221256B2Dec 29, 2015
Print head die
HEWLETT PACKARD DEVELOPMENT CO2 citations58
US11970010B2Apr 30, 2024
Printhead with circulation channel
HEWLETT PACKARD DEVELOPMENT CO0 citations56
US11325379B2May 10, 2022
Fluid ejection dies
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US11220107B2Jan 11, 2022
Printheads
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US10875321B2Dec 29, 2020
Fluid ejection devices to dispense fluid of different sizes
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US10780699B2Sep 22, 2020
Printhead with removable printhead cover
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US10661567B2May 26, 2020
Printheads and methods of fabricating a printhead
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US10434770B2Oct 8, 2019
Printing element temperature adjustment
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US10427406B2Oct 1, 2019
Print bar sensors
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US10363745B2Jul 30, 2019
Printheads with pressure equalization
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US10207497B2Feb 19, 2019
Selecting nozzles
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US9994014B2Jun 12, 2018
Selecting nozzles
HEWLETT PACKARD DEVELOPMENT CO0 citations52
US7862156B2Jan 4, 2011
Heating element
HEWLETT PACKARD DEVELOPMENT CO0 citations51
US7837886B2Nov 23, 2010
Heating element
HEWLETT PACKARD DEVELOPMENT CO0 citations51
US12023937B2Jul 2, 2024
Recirculation bypass
HEWLETT PACKARD DEVELOPMENT CO0 citations48
US9908328B2Mar 6, 2018
Assigning firing reservations to primitives
HEWLETT PACKARD DEVELOPMENT CO0 citations48
US9365034B2Jun 14, 2016
Print head bit information mapping
HEWLETT PACKARD DEVELOPMENT CO0 citations42
HEWLETT PACKARD DEVELOPMENT CO LP
4 patentsUS9623657B2Apr 18, 2017
Fluid dispenser
HEWLETT PACKARD DEVELOPMENT CO LP2 citations72
US9676190B2Jun 13, 2017
Print head die with thermal control
HEWLETT PACKARD DEVELOPMENT CO LP3 citations71
US9511584B2Dec 6, 2016
Print head die with thermal control
HEWLETT PACKARD DEVELOPMENT CO LP1 citations61
US9579893B2Feb 28, 2017
Controlling adhesives between substrates and carriers
HEWLETT PACKARD DEVELOPMENT CO LP0 citations49